10AX032E2F29E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 91 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F29E2LG – Intel Arria 10 GX FPGA, 320,000 logic elements, 780‑FBGA
The 10AX032E2F29E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 780‑ball fine‑pitch BGA package. It is a 20‑nm mid‑range FPGA family device delivering a balance of performance and power efficiency for high‑performance, power‑sensitive applications.
Designed for systems that require significant logic capacity, embedded memory, and flexible I/O, this device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and defense applications described in the Arria 10 device overview.
Key Features
- Logic Capacity Provides 320,000 logic element cells to implement complex programmable logic and custom processing pipelines.
- Embedded Memory Offers 21,040,128 total RAM bits of on‑chip memory to support packet buffering, caches, and intermediate data storage.
- I/O Resources 360 general‑purpose I/O pins to interface with external memory, transceivers, and peripheral devices.
- Package and Mounting 780‑ball FBGA (29×29) package in a surface‑mount format for high‑density board designs and reliable solder assembly.
- Power Core voltage supply range from 0.870 V to 0.980 V to support the device’s low‑voltage core requirements.
- Operating Range and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for a broad set of commercial and telecom environments.
- Arria 10 Family Technologies As part of the Arria 10 family, the device is described in the device overview as leveraging 20‑nm process advantages and family features such as variable‑precision DSP blocks, embedded memory blocks, clock networks and PLL clock sources, and hard IP for PCIe and high‑speed serial protocols.
- Compliance RoHS compliant to meet lead‑free assembly and environmental requirements.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging the device’s programmable logic and embedded memory.
- Wireline Networking 40G/100G muxponders, transponders, and line cards where high logic density and flexible I/O are required.
- Broadcast and Media Studio switching, video transport, and professional audio/video processing using on‑chip memory and DSP capabilities.
- Computing and Storage Server acceleration, flash cache controllers, and cloud infrastructure components that benefit from high logic capacity and family features like PCIe hard IP.
- Medical and Defense Systems Diagnostic imaging, radar, and electronic warfare subsystems that require reconfigurable logic and embedded memory resources.
Unique Advantages
- High Logic Capacity: 320,000 logic element cells enable implementation of large, complex designs without external glue logic.
- Substantial On‑Chip RAM: Over 21 million bits of embedded RAM reduce external memory dependency and improve data throughput for buffering and caches.
- Flexible I/O Count: 360 I/O pins support diverse interface requirements and high‑pin‑count system designs.
- Compact, High‑Density Package: 780‑FBGA (29×29) package allows dense PCB routing and supports high‑performance board layouts.
- Power‑Efficient Core Voltage Range: Low core voltage range (0.870–0.980 V) supports power‑sensitive designs described for the Arria 10 family.
- Extended Grade Reliability: Rated for 0 °C to 100 °C operation for a wide set of commercial and telecom deployments.
Why Choose 10AX032E2F29E2LG?
The 10AX032E2F29E2LG brings the Arria 10 GX family capabilities into a single high‑density FPGA offering substantial logic, memory, and I/O resources. Its combination of 320,000 logic element cells, 21,040,128 bits of embedded RAM, and a 360‑pin I/O footprint makes it well suited to mid‑range systems that demand reconfigurability and on‑device data handling.
Engineers and procurement teams selecting this device gain access to Arria 10 family technologies—such as DSP blocks, flexible clocking, and hard IP support—while benefiting from a surface‑mount 780‑FBGA package and extended temperature grade for robust deployment in telecom, networking, broadcast, compute, medical, and defense applications.
Request a quote or contact sales to obtain pricing and availability for the 10AX032E2F29E2LG.

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