10AX032E2F29I1SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 828 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 13 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F29I1SG – Arria 10 GX FPGA, 320,000 logic elements, 780-FBGA (29×29)
The 10AX032E2F29I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It is a 20 nm mid-range FPGA family device designed for high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.
With 320,000 logic elements, on-chip embedded memory, high-speed serial transceiver capability and industry-grade operating range, this device addresses demanding midrange designs that require a balance of performance and power efficiency.
Key Features
- Core Logic — 320,000 logic elements provide substantial programmable fabric for complex logic, control and data-path implementations.
- Embedded Memory — 21,040,128 total RAM bits of on-chip memory support large buffering, caches and local data storage for high-throughput designs.
- I/O Density — 360 general-purpose I/Os enable extensive board-level interfacing and flexible pinout options for high-pin-count systems.
- High-speed Interfaces — Family-level support for PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet capabilities and low-power serial transceivers provide connectivity options for networking and link-layer applications.
- Reconfiguration & Tooling — Supports dynamic and partial reconfiguration and incremental compilation features to optimize development cycles and enable in-field updates.
- Power and Voltage — Operates from 870 mV to 980 mV supply range and incorporates power-management features described in the Arria 10 device family documentation to help control system power use.
- Package & Mounting — Supplied in a 780-FBGA (29×29) surface-mount package (780-BBGA, FCBGA), suitable for compact, high-density board designs.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C, supporting deployment in industrial environments.
- Family Capabilities — Arria 10 family features include adaptive logic modules, variable-precision DSP blocks, extensive clock networks and support for external memory interfaces as described in the device overview.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device’s logic density and transceiver capabilities.
- Wireline Networking — 40G/100G muxponders, transponders and line cards where high-speed serial interfaces and PCIe connectivity are required.
- Broadcast and Media — Studio switches, transport and video-conferencing equipment that benefit from on-chip memory and flexible I/O.
- Computing & Storage — Server acceleration, flash cache and cloud infrastructure applications that use programmable logic and embedded memory for custom acceleration.
- Medical & Defense Systems — Diagnostic imaging, radar and secure communications solutions that require robust temperature operation and field-updatable logic.
Unique Advantages
- High logic density: 320,000 logic elements enable complex system integration on a single device, reducing external components and BOM count.
- On-chip memory capacity: Over 21 million RAM bits support large buffering and local data processing to improve throughput and latency.
- Broad connectivity options: Family-level support for PCIe and 10 Gbps Ethernet, plus low‑power serial transceivers, simplifies integration into high-speed systems.
- Industrial-grade operation: −40°C to 100°C operating range supports deployment in harsher environments typical of industrial and defense applications.
- Flexible packaging and mounting: 780-ball FCBGA (29×29) surface-mount package suits compact, high-density PCB layouts.
- Field configurability: Dynamic and partial reconfiguration capabilities enable in-field upgrades and adaptive system behavior without full reprogramming downtime.
Why Choose 10AX032E2F29I1SG?
This Arria 10 GX device combines substantial programmable logic, large embedded memory, and family-level high-speed interface support in a single industrial‑rated package. It is positioned for midrange designs that require a practical mix of performance, power efficiency and reconfigurability.
Engineers and procurement teams looking to implement high-throughput networking, compute acceleration, broadcast or industrial systems will find the 10AX032E2F29I1SG suitable for scalable designs that leverage the Arria 10 device family’s documented feature set and development ecosystem.
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