10AX032E2F29I1SG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 828 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F29I1SG – Arria 10 GX FPGA, 320,000 logic elements, 780-FBGA (29×29)

The 10AX032E2F29I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It is a 20 nm mid-range FPGA family device designed for high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

With 320,000 logic elements, on-chip embedded memory, high-speed serial transceiver capability and industry-grade operating range, this device addresses demanding midrange designs that require a balance of performance and power efficiency.

Key Features

  • Core Logic — 320,000 logic elements provide substantial programmable fabric for complex logic, control and data-path implementations.
  • Embedded Memory — 21,040,128 total RAM bits of on-chip memory support large buffering, caches and local data storage for high-throughput designs.
  • I/O Density — 360 general-purpose I/Os enable extensive board-level interfacing and flexible pinout options for high-pin-count systems.
  • High-speed Interfaces — Family-level support for PCIe Gen1/Gen2/Gen3 hard IP, 10 Gbps Ethernet capabilities and low-power serial transceivers provide connectivity options for networking and link-layer applications.
  • Reconfiguration & Tooling — Supports dynamic and partial reconfiguration and incremental compilation features to optimize development cycles and enable in-field updates.
  • Power and Voltage — Operates from 870 mV to 980 mV supply range and incorporates power-management features described in the Arria 10 device family documentation to help control system power use.
  • Package & Mounting — Supplied in a 780-FBGA (29×29) surface-mount package (780-BBGA, FCBGA), suitable for compact, high-density board designs.
  • Industrial Temperature Range — Rated for operation from −40°C to 100°C, supporting deployment in industrial environments.
  • Family Capabilities — Arria 10 family features include adaptive logic modules, variable-precision DSP blocks, extensive clock networks and support for external memory interfaces as described in the device overview.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device’s logic density and transceiver capabilities.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards where high-speed serial interfaces and PCIe connectivity are required.
  • Broadcast and Media — Studio switches, transport and video-conferencing equipment that benefit from on-chip memory and flexible I/O.
  • Computing & Storage — Server acceleration, flash cache and cloud infrastructure applications that use programmable logic and embedded memory for custom acceleration.
  • Medical & Defense Systems — Diagnostic imaging, radar and secure communications solutions that require robust temperature operation and field-updatable logic.

Unique Advantages

  • High logic density: 320,000 logic elements enable complex system integration on a single device, reducing external components and BOM count.
  • On-chip memory capacity: Over 21 million RAM bits support large buffering and local data processing to improve throughput and latency.
  • Broad connectivity options: Family-level support for PCIe and 10 Gbps Ethernet, plus low‑power serial transceivers, simplifies integration into high-speed systems.
  • Industrial-grade operation: −40°C to 100°C operating range supports deployment in harsher environments typical of industrial and defense applications.
  • Flexible packaging and mounting: 780-ball FCBGA (29×29) surface-mount package suits compact, high-density PCB layouts.
  • Field configurability: Dynamic and partial reconfiguration capabilities enable in-field upgrades and adaptive system behavior without full reprogramming downtime.

Why Choose 10AX032E2F29I1SG?

This Arria 10 GX device combines substantial programmable logic, large embedded memory, and family-level high-speed interface support in a single industrial‑rated package. It is positioned for midrange designs that require a practical mix of performance, power efficiency and reconfigurability.

Engineers and procurement teams looking to implement high-throughput networking, compute acceleration, broadcast or industrial systems will find the 10AX032E2F29I1SG suitable for scalable designs that leverage the Arria 10 device family’s documented feature set and development ecosystem.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the 10AX032E2F29I1SG.

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