10AX032E2F29I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 184 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F29I2LG – Arria 10 GX FPGA, 780‑BBGA FCBGA
The 10AX032E2F29I2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 780‑ball FCBGA package designed for midrange, performance‑sensitive embedded systems. It combines a high density of logic elements, large embedded RAM, and a versatile I/O complement to address markets such as wireless, wireline, broadcast, computing and storage, medical, and defense.
Built for power‑efficient, high‑throughput designs, this industrial‑grade device is suited to applications that require substantial programmable logic, on‑chip memory, and flexible I/O while operating across an extended temperature range.
Key Features
- Core Logic Density — 320,000 logic elements provide ample programmable fabric for complex digital designs and system acceleration.
- Embedded Memory — 21,040,128 total RAM bits of on‑chip memory support large buffering, caching, and data‑path implementations.
- I/O Capacity — 360 I/O pins enable extensive peripheral and memory interfacing options for multi‑channel systems.
- Transceiver and Interface Capabilities (Device Family) — Family documentation references support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers, enabling high‑speed serial and protocol connectivity when implemented.
- Clocking and DSP — The Arria 10 family includes clock networks, PLL clock sources, and variable‑precision DSP blocks suitable for signal processing and timing‑sensitive designs.
- Package and Mounting — 780‑BBGA (FCBGA), supplier package 780‑FBGA, FC (29×29), surface‑mount construction for standard PCB assembly flows.
- Power Supply — Core supply range specified from 870 mV to 980 mV to match system power architectures.
- Industrial Temperature Grade — Rated for operation from −40°C to 100°C for deployment in extended‑temperature environments.
- Regulatory — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel processing, switch cards, and baseband aggregation where programmable logic and DSP resources accelerate PHY and MAC functions.
- Wireline Networking — Line cards, muxponders, and transponders leveraging on‑chip memory and serial interface hard IP for high‑speed transport and protocol handling.
- Broadcast and Media — Studio switches, video transport, and encoding/decoding front ends that require flexible I/O and large on‑chip buffers.
- Compute and Storage Acceleration — Server offload, flash cache, and custom accelerator roles using dense logic and embedded RAM for latency‑sensitive workloads.
- Medical and Defense Systems — Diagnostic imaging, radar, and secure communications implementations that benefit from industrial temperature range and configurable logic resources.
Unique Advantages
- High Logic Capacity: 320,000 logic elements enable integration of complex state machines, datapaths, and custom accelerators on a single device, reducing system BOM and board count.
- Large On‑Chip Memory: Over 21 million RAM bits allow sizable buffering and on‑chip data staging to improve throughput and reduce external memory dependency.
- Robust I/O Count: 360 I/Os support broad connectivity for multi‑lane interfaces, parallel buses, and mixed‑signal front ends.
- Industrial‑Grade Operation: −40°C to 100°C rating supports deployment in extended‑temperature environments common to infrastructure and defense applications.
- Compact, Assembly‑Ready Package: 780‑BBGA FCBGA (29×29) provides a dense, surface‑mount footprint for space‑constrained boards while retaining high pin count.
- Power‑Optimized Core Voltage: Core supply range of 870–980 mV enables integration with modern power distribution schemes for efficient operation.
Why Choose 10AX032E2F29I2LG?
The 10AX032E2F29I2LG positions itself as a midrange, performance‑oriented FPGA choice for engineers who need a balance of high logic density, significant on‑chip memory, and flexible I/O in an industrial temperature package. It is appropriate for designs that require programmable acceleration, protocol handling, and complex signal processing while maintaining power and board‑level integration considerations.
Customers designing infrastructure, broadcast, compute acceleration, medical imaging, or defense systems can rely on the Arria 10 family capabilities—documented support for high‑speed interfaces, PLL/clocking resources, and DSP primitives—combined with Intel’s device documentation and ecosystem to support development and deployment.
Request a quote or submit an inquiry to obtain pricing, lead‑time, and availability for the 10AX032E2F29I2LG Arria 10 GX FPGA.

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