10AX032E2F29I2LG

IC FPGA 360 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA

Quantity 184 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O360Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E2F29I2LG – Arria 10 GX FPGA, 780‑BBGA FCBGA

The 10AX032E2F29I2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 780‑ball FCBGA package designed for midrange, performance‑sensitive embedded systems. It combines a high density of logic elements, large embedded RAM, and a versatile I/O complement to address markets such as wireless, wireline, broadcast, computing and storage, medical, and defense.

Built for power‑efficient, high‑throughput designs, this industrial‑grade device is suited to applications that require substantial programmable logic, on‑chip memory, and flexible I/O while operating across an extended temperature range.

Key Features

  • Core Logic Density — 320,000 logic elements provide ample programmable fabric for complex digital designs and system acceleration.
  • Embedded Memory — 21,040,128 total RAM bits of on‑chip memory support large buffering, caching, and data‑path implementations.
  • I/O Capacity — 360 I/O pins enable extensive peripheral and memory interfacing options for multi‑channel systems.
  • Transceiver and Interface Capabilities (Device Family) — Family documentation references support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers, enabling high‑speed serial and protocol connectivity when implemented.
  • Clocking and DSP — The Arria 10 family includes clock networks, PLL clock sources, and variable‑precision DSP blocks suitable for signal processing and timing‑sensitive designs.
  • Package and Mounting — 780‑BBGA (FCBGA), supplier package 780‑FBGA, FC (29×29), surface‑mount construction for standard PCB assembly flows.
  • Power Supply — Core supply range specified from 870 mV to 980 mV to match system power architectures.
  • Industrial Temperature Grade — Rated for operation from −40°C to 100°C for deployment in extended‑temperature environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel processing, switch cards, and baseband aggregation where programmable logic and DSP resources accelerate PHY and MAC functions.
  • Wireline Networking — Line cards, muxponders, and transponders leveraging on‑chip memory and serial interface hard IP for high‑speed transport and protocol handling.
  • Broadcast and Media — Studio switches, video transport, and encoding/decoding front ends that require flexible I/O and large on‑chip buffers.
  • Compute and Storage Acceleration — Server offload, flash cache, and custom accelerator roles using dense logic and embedded RAM for latency‑sensitive workloads.
  • Medical and Defense Systems — Diagnostic imaging, radar, and secure communications implementations that benefit from industrial temperature range and configurable logic resources.

Unique Advantages

  • High Logic Capacity: 320,000 logic elements enable integration of complex state machines, datapaths, and custom accelerators on a single device, reducing system BOM and board count.
  • Large On‑Chip Memory: Over 21 million RAM bits allow sizable buffering and on‑chip data staging to improve throughput and reduce external memory dependency.
  • Robust I/O Count: 360 I/Os support broad connectivity for multi‑lane interfaces, parallel buses, and mixed‑signal front ends.
  • Industrial‑Grade Operation: −40°C to 100°C rating supports deployment in extended‑temperature environments common to infrastructure and defense applications.
  • Compact, Assembly‑Ready Package: 780‑BBGA FCBGA (29×29) provides a dense, surface‑mount footprint for space‑constrained boards while retaining high pin count.
  • Power‑Optimized Core Voltage: Core supply range of 870–980 mV enables integration with modern power distribution schemes for efficient operation.

Why Choose 10AX032E2F29I2LG?

The 10AX032E2F29I2LG positions itself as a midrange, performance‑oriented FPGA choice for engineers who need a balance of high logic density, significant on‑chip memory, and flexible I/O in an industrial temperature package. It is appropriate for designs that require programmable acceleration, protocol handling, and complex signal processing while maintaining power and board‑level integration considerations.

Customers designing infrastructure, broadcast, compute acceleration, medical imaging, or defense systems can rely on the Arria 10 family capabilities—documented support for high‑speed interfaces, PLL/clocking resources, and DSP primitives—combined with Intel’s device documentation and ecosystem to support development and deployment.

Request a quote or submit an inquiry to obtain pricing, lead‑time, and availability for the 10AX032E2F29I2LG Arria 10 GX FPGA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up