10AX032E3F27I2LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA

Quantity 986 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032E3F27I2LG – Arria 10 GX FPGA, 672-BBGA (FCBGA), Industrial

The 10AX032E3F27I2LG is an Intel Arria 10 GX field programmable gate array supplied in a 672-ball FCBGA package. It combines a high logic element count with substantial embedded RAM and a broad I/O complement, targeting midrange applications that require programmable acceleration, protocol bridging and high-speed serial connectivity.

As part of the Arria 10 device family, this device is built on a 20 nm architecture with power-efficiency and performance-focused features such as variable-precision DSP blocks, embedded memory, and integrated hard IP for high-speed interfaces.

Key Features

  • Logic Capacity  320,000 logic elements provide significant programmable fabric for complex logic, control and acceleration tasks.
  • Embedded Memory & DSP  21,040,128 total RAM bits of on-chip memory and support for variable-precision DSP blocks for data buffering and arithmetic acceleration.
  • I/O and Package  240 user I/O pins in a surface-mount 672-BBGA (FCBGA) package, supplier package listed as 672-FBGA, FC (27 × 27), suitable for board-level integration where dense I/O and compact packaging are required.
  • High-speed Interfaces & Hard IP  Arria 10 GX family features include hard IP for PCI Express Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet (documented at the device-family level).
  • Clocking and Reconfiguration  Rich clock-network and PLL resources plus support for dynamic and partial reconfiguration at the device-family level to enable flexible system partitioning and runtime updates.
  • Power and Supply  Specified core supply range of 870 mV to 930 mV, reflecting the device’s low-voltage core requirements described for the family.
  • Operating Range & Compliance  Industrial-grade operation from -40 °C to 100 °C and RoHS compliant.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging programmable logic and DSP acceleration.
  • Wireline and optical networking  40G/100G muxponders, transponders and 100G line cards using the device’s logic capacity, embedded memory and hard IP for high-speed protocols.
  • Broadcast and professional AV  Studio switches, videoconferencing and professional audio/video processing where flexible I/O and on-chip memory support packet handling and format conversion.
  • Computing and storage  Server acceleration, flash cache and cloud compute functions that benefit from large programmable fabric and DSP resources.
  • Medical and industrial systems  Diagnostic imaging and other midrange systems requiring industrial temperature operation and substantial on-chip memory and logic.

Unique Advantages

  • High logic density: 320,000 logic elements allow complex algorithms and multi-function designs to be implemented on a single device, reducing BOM and board-level complexity.
  • Large on-chip RAM: Over 21 million bits of embedded RAM support deep buffering, frame storage and data-path staging without immediate dependence on external memory.
  • Integrated protocol hard IP: Family-level PCIe Gen1/2/3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet reduce development time for common high-speed interfaces.
  • Flexible I/O and compact package: 240 I/Os in a 672-ball FCBGA (27 × 27) package offer a dense I/O footprint for high-pin-count applications in a shipment-friendly surface-mount form factor.
  • Industrial operating range: Rated from -40 °C to 100 °C to support deployments in temperature-demanding environments.
  • Power-aware architecture: 20 nm Arria 10 family features and a defined core voltage range (870 mV–930 mV) support designs focused on balancing performance and power consumption.

Why Choose 10AX032E3F27I2LG?

The 10AX032E3F27I2LG positions itself where midrange FPGA performance and integration are required: substantial logic and memory resources, family-provided high-speed interface IP, and industrial temperature capability. Its 672-ball FCBGA package and 240 I/Os make it suitable for compact, I/O-dense board designs.

Designed as part of the Intel Arria 10 device family, the device benefits from documented features such as advanced clocking, DSP and reconfiguration support, offering a platform that scales across networking, broadcast, compute acceleration and industrial applications while providing a clear upgrade path within the family.

Request a quote or submit an inquiry to obtain pricing, availability and configuration support for part number 10AX032E3F27I2LG.

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