10AX032E2F29I2SG

The 10AX032E2F29I2SG is an Arria 10 GX field-programmable gate array (FPGA) IC offered in a 780‑ball FCBGA package. It is a 20 nm mid-range FPGA device designed to deliver a balance of performance and power efficiency for a range of communication, compute and industrial applications.

Built for systems that need high logic density, embedded memory, programmable DSP resources and high-speed interfaces, the device targets markets such as wireless, wireline, broadcast, computing and storage, medical and military systems.

Key Features

• Core Logic — 320,000 logic elements providing substantial programmable capacity for complex logic and control functions.
• Embedded Memory — 21,040,128 total RAM bits for on-chip buffering, caching and packet processing.
• I/O Density — 360 I/O points to connect diverse peripherals, memory interfaces and board-level interfaces.
• Transceivers & DSP — Includes Arria 10 family features such as variable-precision DSP blocks and low-power serial transceivers for signal processing and high-speed data links.
• Hard IP & Interface Support — Family-level support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Ethernet and Interlaken, and multi-standard external memory interfaces.
• Clocking and PLLs — Fractional synthesis and I/O PLLs for flexible clocking and deterministic timing across multi-rate domains.
• Configuration & Reconfiguration — Supports the Arria 10 device family’s capabilities for dynamic and partial reconfiguration to update logic without full device reprogramming.
• Power — Device family emphasizes power efficiency; this part operates from a core voltage range of 870 mV to 980 mV.
• Package & Mounting — 780‑BBGA FCBGA (29×29) surface-mount package suitable for compact, high-density board designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.

Typical Applications

• Wireless Infrastructure — Channel and switch cards, remote radio heads and mobile backhaul designs leveraging programmable DSP and high-speed transceivers.
• Wireline Networking — 40G/100G muxponders, transponders and line cards where PCIe and Ethernet interfaces and high logic density are required.
• Broadcast & Media — Studio switching and professional audio/video processing that benefit from on-chip memory and DSP resources.
• Compute & Storage Acceleration — Flash cache, server acceleration and cloud compute offload using the device’s logic and embedded memory.
• Medical & Defense Systems — Diagnostic imaging, radar and electronic warfare applications that require industrial temperature operation and reconfigurable logic.

Unique Advantages

• High Logic Capacity: 320,000 logic elements enable complex protocol stacks, packet processing or custom acceleration engines on a single device.
• Substantial On-Chip Memory: Over 21 million bits of embedded RAM reduce external memory bandwidth requirements and simplify buffer management.
• Flexible I/O and Interfaces: 360 I/Os and family-level support for PCIe, Ethernet and external memory standards simplify system integration.
• Power-Efficient Operation: Documented family-level power-saving technologies and a core supply range of 870–980 mV help designs meet thermal and power budgets.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments.
• Compact, Board-Level Package: 780‑ball FCBGA (29×29) offers a dense footprint for space-constrained, high-performance boards.

Why Choose 10AX032E2F29I2SG?

The 10AX032E2F29I2SG Arria 10 GX FPGA delivers a combination of high logic density, significant embedded memory and flexible I/O in a compact industrial-grade FCBGA package. It is positioned for mid-range designs that require a balance of performance and power efficiency, with the family-level capabilities for transceivers, DSPs, hard IP and partial reconfiguration.

This device is suited to system architects and engineers designing communication, compute, broadcast, medical and defense applications who need a programmable, reconfigurable platform with documented device features and industrial temperature support.

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