10AX032E3F27I2SG

The 10AX032E3F27I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) delivered in a 672-BBGA (27×27) FCBGA package for surface-mount applications. It combines a high logic capacity architecture with abundant embedded memory and I/O to support mid-range, performance-sensitive designs.

Arria 10 devices target markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where higher performance and power efficiency are required for functions like switching, packet processing, and acceleration.

Key Features

• Core Logic  320,000 logic elements provide a high-density fabric for complex digital functions and custom accelerators.
• Embedded Memory  21,040,128 total RAM bits of on-chip memory support large buffers, FIFOs, and local storage for compute blocks.
• I/O Capacity  240 I/O pins accommodate wide external interfaces and peripheral connectivity for system integration.
• Transceiver and Interface Capability (Family-level)  Arria 10 family documentation highlights support for serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, and enhanced PCS for Interlaken and 10 Gbps Ethernet.
• Power and Voltage  Supported core supply range is 870 mV to 930 mV, enabling targeted power-scaling within system designs.
• Package and Mounting  672-BBGA (FCBGA) 27×27 package, surface-mount mounting type suited for board-level assembly.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems leveraging logic density and on-chip memory.
• Wireline Networking  40G/100G muxponders, transponders, and line cards where high throughput and flexible protocol support are required.
• Broadcast & Media  Studio switches, professional audio/video processing, and transport systems that benefit from dense logic and large embedded RAM.
• Computing & Storage  Server acceleration, flash cache, and cloud compute offload where programmable logic can implement custom data paths and accelerators.
• Medical & Defense  Diagnostic imaging, radar, and secure communications applications that require robust operation across a wide temperature range.

Unique Advantages

• High logic capacity: 320,000 logic elements enable implementation of complex, high-performance digital designs without immediate need for multiple devices.
• Substantial on-chip memory: Over 21 million bits of RAM reduce external memory dependency for buffering and local data storage, simplifying board design.
• Broad I/O and packaging: 240 I/O and a 672-BBGA (27×27) package support dense board-level integration and flexible interfacing.
• Designed for industrial operation: Rated for −40 °C to 100 °C, allowing deployment in temperature-challenging systems.
• Power-targeted core voltage: A specified core supply range of 870 mV–930 mV supports designs focused on power efficiency and controlled power domains.
• Family-level connectivity features: Arria 10 family documentation indicates support for serial transceivers and PCIe hard IP, enabling high-speed serial and packet-processing use cases.

Why Choose 10AX032E3F27I2SG?

The 10AX032E3F27I2SG positions itself for mid-range, performance-sensitive FPGA applications that require a combination of high logic density, substantial embedded memory, and broad I/O in an industrial-temperature, surface-mount package. Its Arria 10 GX heritage brings family-level capabilities such as power-efficient 20 nm architecture and advanced interface options documented across the device family.

Choose this device when your design needs scalable logic resources, on-chip RAM for local buffering, and a package suitable for compact, industrial PCBs—backed by Intel Arria 10 device documentation and family-level feature sets.

Request a quote or submit a sales inquiry today to check availability and receive pricing and lead-time information for 10AX032E3F27I2SG.