10AX032E3F29I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 360 21040128 320000 780-BBGA, FCBGA |
|---|---|
| Quantity | 94 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 360 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E3F29I2SG – Arria 10 GX FPGA — 320,000 logic elements, 360 I/O, 780-BBGA
The 10AX032E3F29I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) device implemented on a 20 nm process, targeted at midrange, high-performance and power-sensitive applications. This industrial-grade device combines a large programmable fabric, substantial embedded memory, and high I/O density in a 780-ball FCBGA (29 × 29) package.
Designed for markets such as wireless, wireline, broadcast, computing and storage, and mission-critical applications, the device emphasizes performance, power efficiency, and system integration for demanding FPGA-based designs.
Key Features
- Programmable Fabric — 320,000 logic elements provide extensive logic capacity for complex custom hardware acceleration and system integration.
- Embedded Memory — 21,040,128 total RAM bits of on-chip memory to support large buffers, packet FIFOs, and state storage without external RAM for many functions.
- I/O Density — 360 device I/Os delivered from the package to support wide external interfaces and multi-channel connectivity.
- Transceivers and Protocol IP — Architecture-level support includes low-power serial transceivers and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet; PCIe Gen1/Gen2/Gen3 Hard IP is also provided by the device family.
- DSP and Clocking — Variable-precision DSP blocks and comprehensive clock networks with PLL clock sources enable precision timing and efficient signal processing (features available across the Arria 10 family).
- Power and Voltage — Supported core voltage supply range is 870 mV to 930 mV, enabling designs targeting the device’s specified power envelope.
- Package and Mounting — 780-BBGA, FCBGA package (supplier package: 780-FBGA, FC 29×29) for surface-mount assembly in compact system layouts.
- Operating Range and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
Typical Applications
- Wireless infrastructure — Channel processing and switch cards where programmable logic and high I/O density accelerate PHY and backhaul functions.
- Wireline transport — Line cards, muxponders, and transponders leveraging embedded memory and protocol hard IP for high-throughput networking equipment.
- Broadcast and media — Studio switches and video-processing paths that benefit from large on-chip memory and DSP resources for real-time audio/video processing.
- Computing and storage — Server acceleration, flash-cache control, and cloud compute offload using the device’s logic capacity and PCIe hard IP.
- Industrial and medical systems — Diagnostic imaging and control systems requiring industrial temperature operation and robust I/O connectivity.
Unique Advantages
- High logic capacity: 320,000 logic elements enable consolidation of multiple functions and hardware accelerators into a single FPGA, reducing BOM and system complexity.
- Substantial on-chip memory: Over 21 million bits of RAM reduce reliance on external memory for buffering and state retention, improving latency and simplifying board design.
- Integrated protocol support: Hard IP for PCIe Gen1/2/3 and enhanced PCS for Interlaken and 10 Gbps Ethernet accelerate time-to-market for network and storage interfaces.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial and temperature-challenging applications.
- Compact, high-density package: 780-ball FCBGA (29 × 29) balances I/O count and board area for space-constrained system designs.
- Power-optimized architecture: 20 nm process and low-voltage core operation (870–930 mV) support power-sensitive designs within the Arria 10 family framework.
Why Choose 10AX032E3F29I2SG?
The 10AX032E3F29I2SG Arria 10 GX FPGA positions itself for midrange applications that require a balance of performance, integration, and power efficiency. Its large logic element count, significant embedded memory, and protocol hard IP make it suitable for designs that need on-chip acceleration, extensive I/O, and high-throughput interfaces.
With industrial-grade temperature support and a compact 780-BBGA package, this device offers long-term value for engineers building robust, scalable systems in wireless, wireline, broadcast, compute/storage, and industrial markets while leveraging the Arria 10 family’s architecture and features.
If you would like pricing, availability, or a formal quote for 10AX032E3F29I2SG, submit a request or inquiry to our sales team specifying quantity and delivery requirements, and we will respond with commercial and technical support options.

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