10AX032E4F27E3LG

The 10AX032E4F27E3LG is an Intel Arria 10 GX series FPGA offered in a 672-ball BGA FCBGA package. It is a 20 nm mid-range FPGA architecture designed for high-performance, power-sensitive applications across diverse markets.

This device provides a high logic-density fabric with substantial on-chip RAM and a large I/O count, packaged for surface-mount assembly and specified for extended-grade operation.

Key Features

• High Logic Density  320,000 logic elements for complex logic integration and large-scale programmable implementations.
• On-Chip Memory  21,040,128 total RAM bits to support buffering, FIFOs, and embedded data storage without immediate external memory dependence.
• I/O Capacity  240 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Process and Architecture  20 nm Arria 10 GX family device — mid-range FPGA architecture focused on performance and power efficiency as described in the device overview.
• Package and Mounting  672-BBGA FCBGA package; supplier device package listed as 672-FBGA, FC (27x27). Surface mount mounting type for PCB integration.
• Power Supply Range  Core voltage specified from 870 mV to 980 mV to match platform power-rail designs.
• Operating Range and Grade  Extended grade with operating temperature from 0 °C to 100 °C and RoHS compliance.
• Series-Level Capabilities  Series documentation references adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, PLL/clock networks, and serial/transceiver and PCIe/10 Gbps Ethernet hard IP available across Arria 10 devices.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment where mid-range FPGA performance and power efficiency are required.
• Wireline and Networking  Line cards, muxponders/transponders and aggregation/bridging applications supporting high-throughput interfaces.
• Broadcast and Pro AV  Studio switching, videoconferencing, and professional audio/video processing that benefit from large logic capacity and on-chip memory.
• Computing and Storage  Flash cache, server acceleration, and cloud infrastructure tasks that use programmable logic for custom offload and data movement.
• Medical and Defense  Diagnostic imaging and signal-processing applications that require a balance of performance and power efficiency.

Unique Advantages

• High logic capacity: 320,000 logic elements enable integration of large custom datapaths and control logic on a single device, reducing external component count.
• Substantial embedded RAM: 21,040,128 total RAM bits provide on-chip storage for buffers and intermediate data, simplifying memory architecture.
• Generous I/O resources: 240 I/O pins support broad parallel interfaces and multiple protocol endpoints without complex multiplexing.
• Compact, board-ready packaging: 672-ball BGA FCBGA (supplier package: 672-FBGA, FC (27x27)) optimized for surface-mount assembly in compact system designs.
• Power and thermal suitability: Core voltage range of 870 mV to 980 mV and extended-grade operation from 0 °C to 100 °C support deployment in temperature-controlled and power-managed applications.
• Series ecosystem features: Arria 10 family documentation highlights DSP blocks, embedded memory options, PLLs, and serial/PCIe hard IP that can be leveraged in system designs.

Why Choose 10AX032E4F27E3LG?

The 10AX032E4F27E3LG Arria 10 GX FPGA delivers a balance of high logic density, substantial on-chip RAM, and flexible I/O in a surface-mount 672-ball package. Its 20 nm Arria 10 family architecture targets mid-range applications where performance and power efficiency matter.

This device is suited for design teams building networking, wireless, broadcast, compute, storage, medical or defense systems that require a scalable, programmable fabric with on-chip memory and broad I/O. The extended grade, RoHS compliance, and documented series features make it a practical choice for production systems that rely on Intel Arria 10 family capabilities.

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