10AX032E2F27I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 21040128 320000 672-BBGA, FCBGA |
|---|---|
| Quantity | 387 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 119900 | Number of Logic Elements/Cells | 320000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21040128 |
Overview of 10AX032E2F27I2SG – Arria 10 GX FPGA, 320,000 logic elements, 672‑BBGA
The 10AX032E2F27I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) supplied in a 672‑ball FCBGA package for surface-mount assembly. It belongs to the Arria 10 device family, a 20‑nm mid-range FPGA family designed for applications that require a balance of performance and power efficiency.
Typical target markets documented for the Arria 10 family include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense applications. The device combines high logic density, embedded RAM, and configurable I/O to address compute- and memory-intensive midrange designs.
Key Features
- Logic Capacity 320,000 logic elements provide the programmable fabric required for complex midrange designs and system-level integration.
- Embedded Memory 21,040,128 total RAM bits on-chip to support large buffering, packet processing, and local data storage needs.
- I/O and Package 240 I/O pins and a 672‑BBGA (672‑FBGA, 27×27) package suitable for dense board designs and high-pin-count interfaces.
- Power Supply Range Supported core voltage range from 870 mV to 980 mV to match system power-rail requirements and device specifications.
- Thermal and Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployed equipment in demanding environments.
- Family-Level IP and Transceivers Arria 10 family documentation describes support for low-power serial transceivers, PCIe Gen1/2/3 hard IP, and 10 Gbps Ethernet capabilities for high-speed connectivity (family-level feature).
- Configuration and Design Flow Family documentation covers dynamic and partial reconfiguration, configuration protocols, and power management features to support advanced development flows (family-level feature).
- RoHS Compliant Device is compliant with RoHS environmental requirements.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems leveraging the device's logic density and embedded memory.
- Wireline and Optical Networking Line cards, muxponders and transponders that require high-speed serial connectivity and on-chip buffering.
- Broadcast and Professional AV Studio switches and transport systems that benefit from programmable logic and deterministic processing.
- Computing and Storage Server acceleration, flash cache, and cloud compute tasks that use FPGA-based offload and local memory resources.
- Medical and Defense Systems Diagnostic imaging and radar/electronic warfare applications where industrial temperature range and robust FPGA resources are required.
Unique Advantages
- High Logic Density: 320,000 logic elements allow integration of complex functions and consolidation of multiple system components into a single FPGA.
- Substantial On‑Chip RAM: Over 21 million RAM bits reduce external memory dependency and improve system throughput for buffering and packet processing.
- High‑Pin, Compact Package: 672‑BBGA (27×27) package delivers a high I/O count in a compact surface-mount footprint for space-constrained boards.
- Industrial Temperature Range: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
- Family-Level Connectivity IP: Arria 10 family documentation includes hardened IP for PCIe and high-speed Ethernet and support for low-power transceivers, simplifying design of high-throughput interfaces.
- Documented Development and Configuration Options: Family documentation covers dynamic/partial reconfiguration and power-management techniques to help optimize system-level performance and power.
Why Choose 10AX032E2F27I2SG?
The 10AX032E2F27I2SG positions itself as a high-capacity, industrial-grade midrange FPGA for systems requiring a balance of programmable logic, significant on-chip RAM, and robust I/O in a compact package. Its specification-set—320,000 logic elements, 21,040,128 RAM bits, 240 I/Os, and a 672‑BBGA package—suits midrange networking, broadcast, compute-acceleration, and imaging applications that must operate across extended temperature ranges.
Choosing this Arria 10 GX device provides scalable FPGA resources within the Intel Arria 10 family framework, supported by family documentation for transceivers, PCIe and Ethernet hard IP, and advanced configuration options to aid development and long-term product deployment.
Request a quote or submit an inquiry to obtain pricing and availability for 10AX032E2F27I2SG and discuss lead times for your project requirements.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018