10AX032E4F29E3SG

The 10AX032E4F29E3SG is an Intel Arria 10 GX field-programmable gate array (FPGA) offered in a 780-ball BGA surface-mount package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs designed for power-efficient, high-performance applications across communications, broadcast, compute and defense markets.

With a large logic fabric, substantial on-chip RAM and broad I/O support, this device targets mid-range designs that require significant programmable logic capacity, high-bandwidth interfaces and flexible system integration while operating within an extended-grade temperature range.

Key Features

• Logic Capacity — 320,000 logic elements providing substantial programmable fabric for complex logic, control and custom acceleration functions.
• Embedded Memory — 21,040,128 total RAM bits for on-chip buffering, FIFOs and data-path storage.
• I/O Density — 360 I/O pins to support a wide range of external interfaces and parallel/serial connectivity.
• Process and Power — Built on the Arria 10 family’s 20 nm architecture focused on performance and power efficiency; supported supply voltage range is 870 mV to 980 mV.
• Package & Mounting — 780-ball BGA package (FCBGA / 780-FBGA, FC 29×29) designed for surface-mount PCB assembly and high-density board layouts.
• Operating Range & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for thermally managed systems.
• Family Capabilities — As an Arria 10 GX device, it is part of a family that provides features such as variable-precision DSP blocks, embedded memory configurations, clock networks with PLLs, and support for high-speed serial interfaces (family-level features).

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and on-chip memory for signal processing and control.
• Wireline networking — Line cards, muxponders and transponders supporting 40G/100G applications where high logic density and flexible I/O are required.
• Compute and storage acceleration — Server acceleration and flash-cache applications leveraging large logic capacity and embedded RAM for custom data-paths and offload tasks.
• Broadcast and professional AV — Studio switches, videoconferencing and transport functions that benefit from high-density programmable logic and plentiful I/O.

Unique Advantages

• High programmable density: 320,000 logic elements enable complex algorithms and multi-function designs on a single device, reducing board-level integration needs.
• Substantial on-chip memory: 21,040,128 RAM bits support large buffers and data-path staging without immediate dependence on external memory.
• Broad I/O support: 360 I/O pins provide flexibility for diverse interface topologies and high-pin-count connectivity.
• Compact, manufacturable package: 780-ball FCBGA (29×29) surface-mount package allows high-density PCB layouts while supporting standard assembly processes.
• Power and process advantages: Part of the Arria 10 20 nm family designed for improved performance-per-watt, operating from 870 mV to 980 mV supply rails.
• Extended-grade reliability: Extended grade classification and 0 °C to 100 °C operating range for use in thermally managed electronic systems.

Why Choose 10AX032E4F29E3SG?

The 10AX032E4F29E3SG positions itself as a high-capacity Arria 10 GX FPGA option for designers who need substantial programmable logic, significant embedded memory and flexible I/O in a compact BGA package. Its combination of 320,000 logic elements, 21,040,128 RAM bits and 360 I/O pins provides the headroom required for mid-range communications, compute acceleration and professional AV systems.

As part of the Arria 10 family, it benefits from the series’ architecture and system-level features—making it suitable for teams seeking a scalable FPGA platform with established device characteristics and ecosystem support for hardware and software development.

If you would like pricing, availability or a formal quote for 10AX032E4F29E3SG, submit a quote request or contact sales to receive details tailored to your project requirements.