10AX032H1F34I1SG

IC FPGA 384 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 384 21040128 320000 1152-BBGA, FCBGA

Quantity 266 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs119900Number of Logic Elements/Cells320000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits21040128

Overview of 10AX032H1F34I1SG – Arria 10 GX FPGA, 1152‑FCBGA (35×35)

The 10AX032H1F34I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑ball FCBGA package. It is part of the Arria 10 family of 20 nm mid‑range FPGAs and SoCs designed for performance and power efficiency.

Targeted at mid‑range, high‑performance and power‑sensitive applications across wireless, wireline, broadcast, computing, storage, medical and military markets, this device delivers large logic and memory capacity with configurable I/O and industry temperature range.

Key Features

  • Logic Capacity 320,000 logic elements for complex programmable logic and high integration.
  • Logic Array Blocks 119,900 CLB resources available for fine‑grained logic mapping and implementation.
  • Embedded Memory 21,040,128 total RAM bits to support large on‑chip buffering and state storage.
  • I/O and Packaging 384 user I/Os and a 1152‑ball FCBGA (35×35) package, designed for surface‑mount implementations.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
  • Supply Voltage Core voltage range 870 mV to 980 mV for the device core.
  • Transceivers and Interface IP Arria 10 family features include low‑power serial transceivers and hard IP options such as PCIe Gen1/Gen2/Gen3 and support for 10 Gbps Ethernet and Interlaken (as described for the device family).
  • On‑die DSP and Clocking Variable‑precision DSP blocks, flexible clock networks and PLL sources are part of the Arria 10 family architecture to support high‑performance signal processing and timing requirements.
  • Mounting and Compliance Surface‑mount package with RoHS compliance.

Typical Applications

  • Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul implementations that require mid‑range FPGA performance and power efficiency.
  • Wireline Networking 40G/100G muxponders, transponders and line cards where integrated transceivers and high logic density are used for packet processing and aggregation.
  • Broadcast and AV Systems Studio switches, videoconferencing and professional audio/video equipment leveraging large on‑chip memory and configurable I/O.
  • Computing and Storage Acceleration Flash cache, server acceleration and cloud computing applications that benefit from programmable logic, DSP blocks and embedded memory.
  • Medical and Defense Electronics Diagnostic imaging, radar, missile guidance and secure communications systems that require industrial temperature operation and robust on‑chip resources.

Unique Advantages

  • High programmable logic density: 320,000 logic elements enable consolidation of complex functions into a single device, reducing BOM and board area.
  • Substantial on‑chip memory: Over 21 million bits of embedded RAM for large buffering, state machines and data‑intensive algorithms without external memory dependence.
  • Flexible high‑speed interfaces: 384 I/Os and Arria 10 family transceiver/IP options simplify integration with high‑speed ethernet, Interlaken and PCIe systems.
  • Industrial‑grade operation: −40 °C to 100 °C rating supports deployments in temperature‑challenging environments.
  • Power‑aware architecture: Core supply range (870 mV–980 mV) and family‑level power‑saving technologies enable efficient operation for power‑sensitive designs.
  • Surface‑mount, production‑ready package: 1152‑ball FCBGA (35×35) provides a compact, manufacturable footprint for system integration.

Why Choose 10AX032H1F34I1SG?

The 10AX032H1F34I1SG Arria 10 GX FPGA combines substantial logic and embedded memory with configurable high‑speed I/O and industrial temperature capability, making it well suited for mid‑range, performance‑ and power‑sensitive designs. As part of the Intel Arria 10 family, it aligns with device documentation and architecture features intended for networking, wireless, broadcast, computing, medical and defense applications.

For engineering teams seeking a single‑device solution that balances logic capacity, on‑chip RAM and interface flexibility while meeting industrial environmental requirements, this FPGA offers clear technical value and platform continuity within the Arria 10 family.

Request a quote or submit a pricing and availability inquiry to receive lead time and volume pricing information for the 10AX032H1F34I1SG.

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