10AX048H3F34I2SG

The 10AX048H3F34I2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) delivered in a high‑density 1152‑ball FCBGA package. It combines a large programmable fabric with substantial on‑chip memory and a wide I/O count to support mid‑range, performance‑sensitive applications.

Designed for markets including wireless, wireline, broadcast, computing and medical applications, this device targets designs that require significant logic capacity, multi‑bank I/O connectivity, and industrial operating range while maintaining power‑efficient operation.

Key Features

• Programmable Logic — 480,000 logic elements to implement complex digital designs and system logic within a single device.
• Embedded Memory — 5,664,768 total RAM bits of on‑chip memory for buffering, packet processing, and algorithm acceleration.
• I/O Density — 492 user I/O pins to support multi‑channel interfaces, parallel buses, or mixed I/O system connectivity.
• Package — 1152‑FBGA (FC) package, 35 × 35 mm format, offering a compact surface‑mount solution for high‑pin‑count designs.
• Power — Core supply range specified at 870 mV to 930 mV to match system power delivery and margin requirements.
• Operating Range — Industrial operating temperature from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Mounting — Surface‑mount package suitable for automated PCB assembly processes.
• RoHS Compliant — Meets lead‑free environmental requirements for modern electronics manufacturing.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging large logic capacity and multi‑I/O connectivity.
• Wireline Communications — 40G/100G muxponders, transponders, and line cards that require high logic density and embedded memory for packet and framing functions.
• Broadcast and Professional AV — Studio switches and transport equipment that benefit from dense I/O and on‑chip RAM for video buffering and switching.
• Computing and Storage — Server acceleration, flash cache, and cloud computing functions that use programmable logic and memory for custom offload and processing tasks.
• Medical Imaging — Diagnostic scanners and imaging equipment that require deterministic processing and broad I/O interfacing.

Unique Advantages

• High Logic Capacity: 480k logic elements allow integration of extensive digital functions and multiple subsystems on a single FPGA, reducing board complexity.
• Significant On‑Chip Memory: 5,664,768 RAM bits provide local storage for high‑throughput buffering, state machines, and dataflow acceleration without external memory dependency.
• Extensive I/O: 492 I/O pins enable rich external connectivity for multi‑channel interfaces, sensors, and high‑speed links.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in harsher environments and extended temperature applications.
• Compact, High‑Pin Package: 1152‑FBGA (35 × 35 mm) provides a dense, surface‑mount footprint for complex systems with PCB area constraints.
• Power‑Managed Core Voltage: Narrow core supply range (0.87–0.93 V) supports controlled power delivery and design margining for reliable operation.

Why Choose 10AX048H3F34I2SG?

The 10AX048H3F34I2SG delivers a balance of large programmable logic, substantial embedded memory, and broad I/O in a single industrial‑rated package. It is positioned for engineers designing mid‑range systems that require high integration, deterministic on‑chip resources, and the ability to support multiple protocol and interface needs without proliferating external components.

For teams focused on scalable, robust designs, this Arria 10 GX device offers a combination of capacity and environmental tolerance that supports long product lifecycles and flexible system architectures.

Request a quote or submit an order inquiry to begin integrating the 10AX048H3F34I2SG into your next design project.