10AX048H4F34E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 5664768 480000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 118 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 492 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048H4F34E3LG – Arria 10 GX Field Programmable Gate Array (FPGA), 480000 logic elements, 1152-BBGA
The 10AX048H4F34E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs designed for high-performance, power-efficient, and highly integrated system designs.
Suitable for midrange, performance- and power-sensitive applications across wireless, wireline, broadcast, computing and storage, medical, and defense markets, this device combines large logic capacity, substantial embedded memory, and flexible I/O in a compact surface-mount package.
Key Features
- Core Logic – 480000 logic elements for complex, high-density logic implementations.
- Embedded Memory – Total RAM capacity of 5,664,768 bits to support large on-chip buffering and scratchpad memory.
- I/O Density – 492 device I/O pins to interface with a wide range of external devices and subsystems.
- Package & Mounting – 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA, FC (35×35); surface-mount design for compact, board-level integration.
- Power Supply – Core voltage supply range from 870 mV to 980 mV for device operation.
- Operating Temperature – Extended grade with defined operating range of 0 °C to 100 °C.
- Family-Level Features (from Arria 10) – Architecture and device overview cite features such as adaptive logic modules, variable-precision DSP blocks, rich clock networks and PLL sources, PCIe Gen1/2/3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, low-power serial transceivers, and support for dynamic and partial reconfiguration.
- Compliance – RoHS compliant for environmental regulation alignment.
Typical Applications
- Wireless Infrastructure: Channel and switch card implementations in remote radio heads and mobile backhaul systems where performance and power efficiency are required.
- Wireline & Networking: Line cards, muxponders, and transponders for 40G/100G systems and aggregation/bridging applications.
- Broadcast & Professional AV: Studio switching, transport, and videoconferencing equipment that require flexible I/O and real-time processing.
- Computing & Storage Acceleration: Server acceleration, flash cache, and cloud computing server functions that leverage high logic density and embedded memory.
- Medical & Defense Systems: Diagnostic imaging subsystems and guidance/control electronics that benefit from the device’s compute density and reconfigurability.
Unique Advantages
- High Gate Density: 480000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing component count and board complexity.
- Substantial On‑Chip Memory: 5,664,768 bits of embedded RAM enable large local buffers and support for memory-intensive algorithms without immediate reliance on external memory.
- Robust I/O Capability: 492 I/O pins support diverse interfaces and parallel connectivity for complex systems integration.
- Compact, High‑Pin Package: 1152-BBGA FCBGA / 1152-FBGA (35×35) packaging balances high pin count with a compact footprint for dense PCB layouts.
- Power‑Aware Operation: Defined core voltage range (870 mV–980 mV) and family-level power-saving technologies support power-sensitive designs.
- Extended Temperature Grade: Qualified for operation from 0 °C to 100 °C, enabling use in environments that require a wider-than-commercial temperature envelope.
Why Choose 10AX048H4F34E3LG?
The 10AX048H4F34E3LG Arria 10 GX FPGA brings high logic capacity, considerable embedded memory, and broad I/O capability in a compact 1152‑BBGA package—making it a strong fit for midrange designs that need a balance of performance and power efficiency. Its extended temperature grading and RoHS compliance further support deployment across a range of commercial and industrial-adjacent applications.
Backed by Arria 10 family documentation and platform features such as advanced DSP blocks, configurable clocking, and hardened interface IP, the device is well suited for development teams targeting scalable, reconfigurable systems where integration density and documented device support matter.
Request a quote or submit an RFQ to check availability and pricing for 10AX048H4F34E3LG today.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018