10AX048H3F34E2LG

The 10AX048H3F34E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑BBGA (FCBGA) package. It belongs to the Arria 10 family of 20‑nm mid‑range FPGAs and SoCs designed for high‑performance, power‑sensitive applications across communications, broadcast, computing, medical, and defense markets.

This device combines 480,000 logic elements, 5,664,768 bits of embedded RAM and 492 I/O pins in a surface‑mount package, providing a compact, high‑density programmable fabric for midrange system designs.

Key Features

• Logic Capacity — 480,000 logic elements for complex midrange FPGA designs and high integration of custom logic functions.
• Embedded Memory — 5,664,768 total RAM bits to support on‑chip buffering, FIFO, and memory‑intensive processing tasks.
• I/O Resources — 492 I/O pins to interface with a wide range of external devices and memory interfaces.
• Package & Mounting — 1152‑BBGA (FCBGA) package, supplier device package listed as 1152‑FBGA, FC (35×35), and surface‑mount mounting for board‑level integration.
• Power Supply — Core voltage supply range 870 mV to 930 mV to match system power rails and design requirements.
• Operating Range & Grade — Extended grade with operating temperature range 0 °C to 100 °C for commercial and midrange environmental requirements.
• Intel Arria 10 Family Capabilities — Part of the Arria 10 family that includes features such as fractional synthesis PLLs, embedded memory configurations, PCIe Gen1/Gen2/Gen3 hard IP, and support for high‑speed serial transceivers (family level).
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly and compliance needs.

Typical Applications

• Wireless Infrastructure — Channel and switch cards or remote radio head functions where midrange performance and power efficiency are required.
• Wireline & Optical Networking — 40G/100G muxponders, transponders and line cards that require programmable logic and high I/O density.
• Broadcast & Pro AV — Studio switching and video transport applications that leverage on‑chip memory and wide I/O for media processing.
• Compute & Storage Acceleration — Cloud and server acceleration tasks such as flash cache and data path offload using the device’s logic and memory resources.
• Medical and Defense Systems — Diagnostic imaging and radar/electronic warfare subsystems that use FPGA flexibility and embedded resources for signal processing.

Unique Advantages

• High Logic Density: 480,000 logic elements enable integration of large custom datapaths, control logic, and algorithm acceleration on a single device.
• Substantial On‑Chip Memory: 5,664,768 bits of embedded RAM reduce dependence on external memory for buffering and intermediate storage.
• Robust I/O Count: 492 I/O pins give designers flexibility to connect multiple peripherals, memory interfaces, and high‑speed links without additional bridging components.
• Compact, Board‑Ready Packaging: 1152‑BBGA FCBGA package with surface‑mount compatibility supports dense PCB designs and automated assembly.
• Power and Thermal Considerations: Core voltage range of 870–930 mV and an operating temperature span of 0 °C to 100 °C support reliable operation in commercial and extended environments.
• Arria 10 Family Ecosystem: Family‑level features such as PCIe hard IP and serial transceiver support provide design building blocks for common high‑performance protocols.

Why Choose 10AX048H3F34E2LG?

The 10AX048H3F34E2LG positions itself as a high‑density, midrange FPGA option within the Intel Arria 10 family, balancing significant logic and memory resources with a large I/O complement and compact FCBGA packaging. Its specifications make it well suited for system designers targeting communications, compute acceleration, media processing, and advanced signal processing where programmable flexibility and integration are essential.

Choosing this device provides a scalable platform for midrange applications that benefit from the Arria 10 family’s on‑chip resources and family‑level hard IP. The combination of logic capacity, embedded RAM, and I/O density supports consolidation of multiple functions into a single device, helping to reduce board complexity and part count.

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