10AX048K2F35E1HG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA

Quantity 1,727 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048K2F35E1HG – Arria 10 GX Field Programmable Gate Array (FPGA), 480,000 logic elements, 1152‑FCBGA (35×35)

The 10AX048K2F35E1HG is an Intel Arria 10 GX FPGA packaged in a 1152‑FBGA (1152‑FCBGA, 35×35 mm) surface‑mount package. It delivers a high‑density midrange FPGA architecture with 480,000 logic elements and 5,664,768 bits of embedded RAM for compute‑intensive, bandwidth‑sensitive designs.

Designed for power‑sensitive, performance‑oriented applications, this extended‑grade device (0 °C to 100 °C) supports a wide range of markets including wireless infrastructure, wireline networking, broadcast, computing and storage, medical imaging, and defense systems.

Key Features

  • Core Logic  480,000 logic elements provide high integration density for complex digital designs.
  • Embedded Memory  5,664,768 total RAM bits enable on‑chip buffering and data staging for high‑throughput pipelines.
  • I/O Capacity  396 I/O pins support extensive external connectivity and multi‑channel interfacing.
  • Package & Mounting  1152‑FCBGA (35×35) package in a surface‑mount form factor for dense board integration.
  • Power and Voltage  Core voltage supply range of 870 mV to 980 mV to support the device’s low‑voltage operation.
  • Extended Temperature Grade  Rated for 0 °C to 100 °C operation to meet a wide set of environmental requirements.
  • Adaptive Logic & DSP  Family features include adaptive logic modules and variable‑precision DSP blocks for customizable arithmetic and signal processing (as documented for Arria 10 devices).
  • High‑Speed Interfaces and IP  Arria 10 family documentation lists support for PCIe Gen1/2/3 hard IP, high‑speed serial transceivers, and enhanced PCS hard IP for 10 Gbps Ethernet and Interlaken (family feature set referenced in device overview).
  • Configuration & Reliability  Device overview describes support for dynamic and partial reconfiguration and SEU detection/correction capabilities (Arria 10 family features).
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leverage the device’s logic density and embedded memory for signal processing and control.
  • Wireline Networking  40G/100G muxponders, transponders and line cards can use the FPGA’s I/O and protocol IP support for high‑speed packet handling and aggregation.
  • Broadcast and Pro Audio/Video  Studio switches, transport and videoconferencing systems benefit from the FPGA’s bandwidth and reconfiguration capabilities for format conversion and routing.
  • Computing & Storage Acceleration  Cloud servers, flash cache controllers and server acceleration tasks use on‑chip RAM and DSP resources for offload and low‑latency processing.
  • Medical & Industrial Imaging  Diagnostic imaging and scanning equipment can exploit the device’s processing resources and I/O density for data capture and real‑time image processing.

Unique Advantages

  • High Logic Density: 480,000 logic elements allow consolidation of large functions onto a single FPGA, reducing board complexity.
  • Substantial On‑Chip Memory: 5,664,768 bits of embedded RAM support deep buffering and large data structures without external memory in many use cases.
  • Robust I/O Count: 396 I/O pins provide flexible interfacing to multiple peripherals, memory systems, and high‑speed PHYs.
  • Extended Temperature Range: 0 °C to 100 °C grading suits deployments in thermally challenging, non‑automotive environments.
  • Low‑Voltage Core: 870–980 mV supply range reflects the device’s low‑voltage operation and power‑sensitive design profile.
  • Arria 10 Family Capabilities: Family features such as variable‑precision DSPs, hard IP for PCIe and Ethernet, transceivers, and partial reconfiguration provide a versatile platform for diverse system designs.

Why Choose 10AX048K2F35E1HG?

The 10AX048K2F35E1HG positions designers to implement high‑density, midrange FPGA solutions that balance performance and power efficiency. With 480,000 logic elements, more than 5.6 million bits of embedded RAM, and 396 I/Os in a compact 1152‑FCBGA package, this Arria 10 GX device is suited to demanding applications in networking, broadcast, compute acceleration, and imaging.

Customers building systems that require substantial on‑chip resources, flexible I/O, and Arria 10 family‑level capabilities will find this device a robust choice for scalable designs, supported by documented device features like DSP blocks, protocol hard IP, and dynamic reconfiguration options.

Request a quote or submit an RFQ to receive pricing, lead‑time and availability information for the 10AX048K2F35E1HG.

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