10AX048K2F35E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 831 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048K2F35E2LG – Arria 10 GX FPGA, 480,000 logic elements, 1152‑BBGA
The 10AX048K2F35E2LG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 1152‑ball BGA package. It combines a large fabric capacity with embedded memory and high‑speed serial and protocol hard IP, targeting mid‑range applications that require a balance of performance and power efficiency.
Built for markets such as wireless, wireline, broadcast, computing and storage, and secure communications, this device delivers the Arria 10 family’s improvements in performance and power‑saving technologies to accelerate system designs while maintaining energy efficiency.
Key Features
- Logic Capacity — 480,000 logic elements and 183,590 logic blocks provide a high‑capacity programmable fabric for complex logic integration.
- On‑Chip Memory — 5,664,768 total RAM bits to support large buffering, caches, and embedded data structures within the FPGA fabric.
- I/O Density — 396 I/O pins to support extensive external interfaces and high‑pin‑count designs.
- High‑Speed Interfaces & Hard IP — Family documentation highlights PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers for demanding serial links.
- DSP and Embedded Architecture — Arria 10 architecture items noted in device documentation include variable‑precision DSP blocks and adaptive logic modules for compute‑intensive signal processing tasks.
- Package & Mounting — 1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, FC, 35×35) in a surface‑mount form factor for high‑density board integration.
- Power Supply — Core voltage range specified at 870 mV to 980 mV to match platform power rails and regulators.
- Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C; RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and low power are required.
- Wireline & Optical Networking — 40G/100G muxponders, transponders, and line cards leveraging high‑speed serial interfaces and protocol hard IP for packet processing and transport.
- Broadcast & Professional AV — Studio switches, transport and videoconferencing equipment that need flexible I/O and on‑chip memory for frame buffering and video processing.
- Computing & Storage Acceleration — Flash cache, server acceleration, and cloud compute cards that use the device’s logic capacity, DSP resources, and memory for offload operations.
- Medical and Secure Communications — Diagnostic imaging and secure comms applications benefiting from programmable logic density and the Arria 10 family’s design resources.
Unique Advantages
- High integration density: 480,000 logic elements and significant embedded RAM reduce the need for external components and simplify complex system designs.
- Protocol and link support: Built‑in hard IP for PCIe and enhanced PCS for Interlaken/10 Gbps Ethernet enable faster time‑to‑market for high‑bandwidth networking products.
- Power‑aware architecture: Family documentation emphasizes power‑saving technologies, enabling designs that balance performance with energy efficiency.
- Extensive I/O and package options: 396 I/Os and a high‑density 1152‑ball FCBGA footprint support rich external connectivity and compact board layouts.
- Design scalability: As part of the Arria 10 device family, this device aligns with available device handbooks and errata documentation to support development and fielding of mid‑range FPGA designs.
- Extended grade operation: Rated from 0 °C to 100 °C for applications requiring a wider commercial temperature range.
Why Choose 10AX048K2F35E2LG?
This Arria 10 GX device positions itself where significant programmable logic, embedded memory, and high‑speed connectivity are required without moving into the highest‑end device classes. Its combination of 480,000 logic elements, multi‑megabit on‑chip RAM, and hard IP for common protocols makes it suitable for mid‑range wireless, wireline, broadcast, compute acceleration, and secure communication designs.
Choosing this device leverages the Arria 10 family’s documented architecture and resources, enabling scalable designs that benefit from integrated DSP blocks, serial transceivers, and a power‑aware implementation approach.
Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the 10AX048K2F35E2LG Arria 10 GX FPGA.

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