10AX048K4F35I3LG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA

Quantity 118 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048K4F35I3LG – Arria 10 GX FPGA IC, 480,000 Logic Elements, 1152-BBGA

The 10AX048K4F35I3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in an industrial-grade, surface-mount 1152-ball BGA package. It delivers a mid-range, power-aware FPGA architecture optimized for high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical and defense markets.

Key on-device resources include 480,000 logic elements, 5,664,768 bits of embedded RAM, and 396 user I/O pins, providing the capacity and I/O bandwidth required for complex signal processing, packet handling, and protocol bridging tasks.

Key Features

  • Core Logic Density — 480,000 logic elements enabling complex custom logic, protocol implementation, and system acceleration.
  • Embedded Memory — 5,664,768 total RAM bits for on-chip buffering, frame storage, and low-latency data paths.
  • I/O and Package — 396 I/O pins in a 1152-BBGA FCBGA package; supplied package: 1152-FBGA, FC (35×35 mm), suitable for compact, high-density board designs with surface-mount assembly.
  • Transceivers and Interfaces (Family Capabilities) — Arria 10 family features include low-power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP and support for 10 Gbps Ethernet and Interlaken protocols, enabling high-speed external connectivity for networking and transport applications.
  • DSP and Clocking (Family Capabilities) — Variable-precision DSP blocks and comprehensive clock networks with PLL/I/O PLL options for fractional synthesis support demanding signal-processing and timing architectures.
  • Power and Voltage — Device supply operating range 870 mV–980 mV, allowing designs to target low-voltage power domains.
  • Operating Range & Reliability — Industrial-grade component rated for −40 °C to 100 °C operation and RoHS compliant for regulatory alignment.

Typical Applications

  • Wireless Infrastructure: Channel and switch cards in remote radio heads and mobile backhaul modules leveraging high logic density and on-chip DSP for RF baseband and control functions.
  • Wireline Transport: 40G/100G muxponders, transponders and 100G line cards using built-in transceivers and PCIe hard IP for high-bandwidth packet handling and protocol conversion.
  • Broadcast & Media: Studio switches, video transport and professional AV processing where embedded RAM and high I/O count support frame buffering and format conversion.
  • Data Center & Storage Acceleration: Flash cache controllers and server acceleration tasks that benefit from abundant logic resources and high-speed interfaces for low-latency data paths.
  • Medical & Defense Imaging: Diagnostic scanners and radar/electronic-warfare subsystems that require deterministic processing, DSP resources and wide operating temperature compliance.

Unique Advantages

  • High Logic Capacity: 480,000 logic elements provide headroom for large-scale RTL designs, protocol stacks and hardware acceleration kernels.
  • Substantial On-Chip Memory: Over 5.6 Mb of embedded RAM reduces dependence on external memory for buffers and short-term data retention, simplifying board-level memory architectures.
  • Flexible I/O and Packaging: 396 I/O pins in a 1152-BBGA/1152-FBGA package format supports dense connector integration and compact PCB layouts.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support industrial and ruggedized deployments without derating core functionality.
  • Low-Voltage Operation: 870 mV–980 mV supply range supports designs targeting low-power system domains and modern power management strategies.
  • Arria 10 Family Capabilities: Family-level features such as variable-precision DSP blocks, advanced clocking, serial transceivers and PCIe hard IP enable integration of high-speed interfaces and compute functions on a single device.

Why Choose 10AX048K4F35I3LG?

The 10AX048K4F35I3LG combines substantial logic and memory resources with a high I/O count and industrial temperature rating, making it a strong choice for mid-range designs that require on-chip processing, protocol acceleration and high-speed connectivity. Its Arria 10 GX family heritage brings architecture-level features—DSP blocks, embedded memory types, clocking and transceiver support—that simplify integration of signal-processing and networking functions.

This device suits engineering teams and procurement focused on scalable FPGA-based solutions that balance performance and power efficiency while meeting industrial environmental and packaging requirements. Its resource set supports a wide range of applications from transport and wireless infrastructure to data-acceleration and imaging systems.

Request a quote or submit a purchasing inquiry to evaluate the 10AX048K4F35I3LG for your next design or production run.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up