10AX048K4F35E3SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 258 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048K4F35E3SG – Arria 10 GX FPGA, 480000 logic elements, 1152‑BBGA
The Intel Arria 10 GX 10AX048K4F35E3SG is a 20‑nm mid‑range Field Programmable Gate Array (FPGA) optimized for high‑performance, power‑sensitive applications. This device integrates 480,000 logic elements, substantial embedded RAM, and a high I/O count in a 1152‑BBGA FCBGA package to support demanding midrange system designs.
Arria 10 devices are positioned for diverse markets where performance and power efficiency matter. Typical use cases include wireless and wireline communications, compute and storage acceleration, broadcast, and medical and defense applications where programmable logic and system-level integration are required.
Key Features
- Logic Capacity — 480,000 logic elements, providing large programmable fabric for complex logic and custom accelerators.
- Logic Blocks (LAB/CLB count) — 183,590 LABs/CLBs for hierarchical logic structuring and efficient resource allocation.
- Embedded Memory — 5,664,768 total RAM bits to support on‑chip buffering, caches, and data storage for FPGA designs.
- High I/O Count — 396 I/O pins to support broad peripheral and memory interfacing requirements.
- Package & Mounting — 1152‑BBGA (FCBGA) package, Supplier Device Package 1152‑FBGA, FC (35×35); surface‑mount mounting type for standard board assembly.
- Power Supply — Core voltage supply range of 870 mV to 980 mV to match system power rails and design constraints.
- Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for reliable operation in commercial and extended‑temperature environments.
- RoHS Compliance — Device is RoHS compliant.
- Device Family Documentation — Part of the Intel Arria 10 device family, with available device overview and handbook documentation for design guidance and implementation details.
Typical Applications
- Wireless infrastructure: Channel and switch cards or remote radio head functions where programmable logic enables signal processing and protocol flexibility.
- Wireline networks: Line cards, muxponders, and transponders that require programmable packet processing and high I/O connectivity.
- Compute and storage acceleration: Offload and acceleration tasks such as caching and server acceleration using on‑chip logic and embedded RAM.
- Broadcast and professional media: Studio switches, transport, and video processing where deterministic, reconfigurable logic is needed.
- Medical and defense equipment: Diagnostic imaging, radar, and secure communications systems leveraging programmable logic for algorithm updates and integration.
Unique Advantages
- High logic density: 480,000 logic elements enable implementation of complex algorithms and large custom accelerators on a single device, reducing board-level component count.
- Substantial on‑chip memory: 5,664,768 RAM bits support data buffering and tight memory locality for performance‑sensitive designs.
- Extensive I/O resources: 396 I/O pins provide flexible external interfacing for memories, transceivers, sensors, and control peripherals.
- Compact FCBGA packaging: 1152‑BBGA package balances high pin count with a compact footprint for space-constrained designs.
- Power‑aware design: Core voltage range (870 mV–980 mV) and Arria 10 family focus on power efficiency help match system power budgets.
- Extended temperature grade: Operates from 0 °C to 100 °C, suitable for extended commercial temperature applications.
- Supported device family resources: Part of the Intel Arria 10 family with published device overviews and handbooks to aid development and system integration.
Why Choose 10AX048K4F35E3SG?
The 10AX048K4F35E3SG Arria 10 GX FPGA combines high logic capacity, significant embedded RAM, and a large I/O count in a single, surface‑mount FCBGA package. It is well suited to midrange designs that need a balance of performance and power efficiency, with documentation and device‑family resources available to support design and integration.
This device targets engineers and system designers building programmable hardware for communications, compute acceleration, broadcast, and medical/defense systems who require a scalable FPGA platform with robust on‑chip resources and extended‑temperature operation.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 10AX048K4F35E3SG Arria 10 GX FPGA.

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