10AX048K3F35E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,791 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 183590 | Number of Logic Elements/Cells | 480000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5664768 |
Overview of 10AX048K3F35E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 480000 logic elements, 1152-BBGA FCBGA
The 10AX048K3F35E2SG is an Intel Arria 10 GX family FPGA: a 20 nm mid-range programmable logic device designed for performance- and power-sensitive applications. This surface-mount, extended‑grade device integrates large logic capacity, on‑chip RAM, and a broad I/O complement to support complex midrange designs.
Part of the Arria 10 device family, it targets markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and military/secure communications where improved performance and power efficiency are required.
Key Features
- Logic Capacity — 480,000 logic elements, providing the resources needed for large, complex designs and high-density logic implementation.
- Embedded Memory — 5,664,768 total RAM bits for on‑chip data buffering, frame storage, and intermediate compute-state memory.
- I/O Density — 396 general-purpose I/O pins to support wide external connectivity and multiple parallel interfaces.
- Power Supply — Core voltage supply range from 870 mV to 930 mV to match system power rails and allow precise power budgeting.
- Package & Mounting — 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA, FC (35×35); surface‑mount mounting type for board-level integration.
- Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent applications that operate within this window.
- RoHS Compliant — Environmentally compliant to RoHS standards.
- Device-Family Capabilities (Arria 10) — As part of the Arria 10 family (20 nm), the series provides device-level features such as power-saving technologies and architectures suited to midrange high-performance applications.
Typical Applications
- Wireless Infrastructure — Channel and switch cards and mobile backhaul equipment that require substantial logic and on-chip memory for real-time signal processing.
- Wireline Networking — Line cards, muxponders and transponders in 40G/100G systems where high logic density and extensive I/O support packet processing and protocol handling.
- Broadcast & Pro AV — Video and audio processing, switching and transport applications that benefit from large on-chip memory and parallel I/O.
- Computing & Storage — Server acceleration, flash cache, and cloud compute functions where programmable logic and embedded memory accelerate data-path tasks.
- Medical & Military Systems — Diagnostic imaging, radar, and guidance/control systems that leverage the family’s focus on performance and power efficiency within a controlled temperature range.
Unique Advantages
- High logic density: 480,000 logic elements enable implementation of complex algorithms and multiple parallel processing engines on a single device, reducing board count.
- Substantial on‑chip RAM: 5.66 Mb of embedded RAM supports frame buffers, FIFOs and local data storage to minimize external memory accesses and simplify design.
- Broad I/O capacity: 396 I/O pins allow direct interfacing to wide buses and multiple high-throughput peripherals without extensive external glue logic.
- Compact, standard package: 1152‑BBGA (35×35) supply‑footprint simplifies PCB layout for high-density applications while supporting surface-mount assembly.
- Controlled power envelope: Core supply range (870–930 mV) supports precise power management and integration into regulated power architectures.
- Family-level power efficiency: As an Arria 10 device, it benefits from device-family power-saving approaches for lower runtime energy use in power-sensitive designs.
Why Choose 10AX048K3F35E2SG?
The 10AX048K3F35E2SG positions itself as a high‑capacity, midrange FPGA option for designers who need substantial logic, embedded memory, and extensive I/O in a single surface‑mount package. Its extended grade and 0 °C to 100 °C operating range make it suitable for many commercial and mission‑critical systems that operate within that thermal window.
Choosing this Arria 10 GX device brings the benefits of a 20 nm device family focused on performance and power efficiency while providing the raw resources—logic elements, RAM bits, and I/O—to accelerate complex signal-processing, networking, and compute tasks with fewer components and a lower overall BOM.
Request a quote or submit an inquiry for pricing and availability of the 10AX048K3F35E2SG to evaluate its fit for your next design.

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