10AX048K3F35E2SG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA

Quantity 1,791 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048K3F35E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 480000 logic elements, 1152-BBGA FCBGA

The 10AX048K3F35E2SG is an Intel Arria 10 GX family FPGA: a 20 nm mid-range programmable logic device designed for performance- and power-sensitive applications. This surface-mount, extended‑grade device integrates large logic capacity, on‑chip RAM, and a broad I/O complement to support complex midrange designs.

Part of the Arria 10 device family, it targets markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and military/secure communications where improved performance and power efficiency are required.

Key Features

  • Logic Capacity — 480,000 logic elements, providing the resources needed for large, complex designs and high-density logic implementation.
  • Embedded Memory — 5,664,768 total RAM bits for on‑chip data buffering, frame storage, and intermediate compute-state memory.
  • I/O Density — 396 general-purpose I/O pins to support wide external connectivity and multiple parallel interfaces.
  • Power Supply — Core voltage supply range from 870 mV to 930 mV to match system power rails and allow precise power budgeting.
  • Package & Mounting — 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA, FC (35×35); surface‑mount mounting type for board-level integration.
  • Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent applications that operate within this window.
  • RoHS Compliant — Environmentally compliant to RoHS standards.
  • Device-Family Capabilities (Arria 10) — As part of the Arria 10 family (20 nm), the series provides device-level features such as power-saving technologies and architectures suited to midrange high-performance applications.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards and mobile backhaul equipment that require substantial logic and on-chip memory for real-time signal processing.
  • Wireline Networking — Line cards, muxponders and transponders in 40G/100G systems where high logic density and extensive I/O support packet processing and protocol handling.
  • Broadcast & Pro AV — Video and audio processing, switching and transport applications that benefit from large on-chip memory and parallel I/O.
  • Computing & Storage — Server acceleration, flash cache, and cloud compute functions where programmable logic and embedded memory accelerate data-path tasks.
  • Medical & Military Systems — Diagnostic imaging, radar, and guidance/control systems that leverage the family’s focus on performance and power efficiency within a controlled temperature range.

Unique Advantages

  • High logic density: 480,000 logic elements enable implementation of complex algorithms and multiple parallel processing engines on a single device, reducing board count.
  • Substantial on‑chip RAM: 5.66 Mb of embedded RAM supports frame buffers, FIFOs and local data storage to minimize external memory accesses and simplify design.
  • Broad I/O capacity: 396 I/O pins allow direct interfacing to wide buses and multiple high-throughput peripherals without extensive external glue logic.
  • Compact, standard package: 1152‑BBGA (35×35) supply‑footprint simplifies PCB layout for high-density applications while supporting surface-mount assembly.
  • Controlled power envelope: Core supply range (870–930 mV) supports precise power management and integration into regulated power architectures.
  • Family-level power efficiency: As an Arria 10 device, it benefits from device-family power-saving approaches for lower runtime energy use in power-sensitive designs.

Why Choose 10AX048K3F35E2SG?

The 10AX048K3F35E2SG positions itself as a high‑capacity, midrange FPGA option for designers who need substantial logic, embedded memory, and extensive I/O in a single surface‑mount package. Its extended grade and 0 °C to 100 °C operating range make it suitable for many commercial and mission‑critical systems that operate within that thermal window.

Choosing this Arria 10 GX device brings the benefits of a 20 nm device family focused on performance and power efficiency while providing the raw resources—logic elements, RAM bits, and I/O—to accelerate complex signal-processing, networking, and compute tasks with fewer components and a lower overall BOM.

Request a quote or submit an inquiry for pricing and availability of the 10AX048K3F35E2SG to evaluate its fit for your next design.

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