10AX048K3F35E2LG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA

Quantity 697 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048K3F35E2LG – Arria 10 GX FPGA, 480,000 logic elements, 5,664,768 RAM bits

The 10AX048K3F35E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) IC optimized for mid-range, high-performance and power-efficient designs. Built on the Arria 10 device family architecture, it combines a large logic fabric with extensive embedded memory and high I/O density for demanding communications, compute and signal-processing applications.

This device targets markets such as wireless and wireline infrastructure, broadcast, computing and storage, medical and defense systems, delivering performance and power-efficiency appropriate for high-throughput, latency-sensitive designs.

Key Features

  • Logic Capacity  Provides 480,000 logic elements to implement complex custom logic, control and data-path functions.
  • Embedded Memory  Includes 5,664,768 total RAM bits for on-chip buffering, lookup tables and state storage.
  • High I/O Count  396 device I/O pins to support wide parallel interfaces, multi-channel data lanes and extensive external connectivity.
  • Transceiver and Protocol Support (Device-Family Level)  Arria 10 family features include low-power serial transceivers and protocol hard IP such as PCIe Gen1/2/3 and 10 Gbps Ethernet support, enabling high-speed external links and standard interface integration.
  • DSP and Clocking (Device-Family Level)  Variable-precision DSP blocks and advanced clock networks with PLL clock sources support signal processing and timing-critical designs.
  • Power and Voltage  Operates with a supply range from 870 mV to 930 mV, reflecting the device’s optimized low-voltage power domain.
  • Package and Mounting  Supplied in a 1152-BBGA (FCBGA) package — supplier device package listed as 1152-FBGA, FC (35×35) — for surface-mount assembly.
  • Extended Grade  Specified for operation over a temperature range of 0 °C to 100 °C, meeting the needs of many industrial and commercial environments.
  • Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and high I/O density enable flexible RF and baseband processing.
  • Wireline Communications  40G/100G muxponders, transponders and 100G line cards that require high-speed interfaces and on-chip buffering.
  • Broadcast and Media  Studio switching, transport servers and professional audio/video processing where deterministic processing and low-latency datapaths are required.
  • Compute and Storage Acceleration  Flash cache, server acceleration and cloud-computing server applications that leverage programmable logic and embedded memory for custom offload functions.
  • Medical and Defense Systems  Diagnostic imaging, radar and electronic warfare payloads benefiting from high logic density and flexible I/O for signal processing and control.

Unique Advantages

  • High integration density: 480,000 logic elements combined with 5.66 Mbits of on-chip RAM reduce external component count and simplify board design.
  • Extensive I/O capacity: 396 I/Os enable broad interfacing options for multi-lane and multi-protocol systems without external multiplexing.
  • Family-level protocol and transceiver support: Arria 10 family features such as PCIe and 10 Gbps Ethernet hard IPs and low-power transceivers help accelerate integration of standard high-speed links.
  • Power-optimized operation: The device family emphasizes power efficiency and this part’s 870–930 mV supply range supports low-voltage power architectures.
  • Production-ready packaging and grade: Surface-mount 1152-BBGA packaging and extended 0 °C to 100 °C operating range suit commercial and industrial applications.
  • Standards and compliance: RoHS compliance helps meet environmental and manufacturing requirements for modern production flows.

Why Choose 10AX048K3F35E2LG?

The 10AX048K3F35E2LG Arria 10 GX FPGA brings a combination of large logic capacity, substantial on-chip memory and high I/O density in a surface-mount BBGA package. It is positioned for mid-range, performance- and power-sensitive applications that require flexible, programmable hardware to handle complex signal processing, high-speed interfacing and protocol acceleration.

Designers benefit from the Arria 10 family’s documented device features and implementation resources while leveraging this part’s extended temperature grade and RoHS compliance for reliable deployment in a variety of commercial and industrial systems.

Request a quote or submit a pricing and availability inquiry to evaluate 10AX048K3F35E2LG for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up