10AX048K3F35I2LG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 5664768 480000 1152-BBGA, FCBGA

Quantity 642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs183590Number of Logic Elements/Cells480000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5664768

Overview of 10AX048K3F35I2LG – Arria 10 GX FPGA, 480,000 logic elements, 396 I/Os, 1152‑BBGA

The Intel Arria 10 GX 10AX048K3F35I2LG is a 20‑nm mid‑range FPGA offering a balance of performance and power efficiency for demanding embedded and communications applications. As an Arria 10 GX device, it integrates a high logic count, substantial embedded memory, and advanced I/O capabilities to support high‑bandwidth, latency‑sensitive designs.

Targeted at wireless, wireline, broadcast, computing/storage, medical and defense markets, this industrial‑grade FPGA is designed for mid‑range applications that require significant programmable logic, on‑chip RAM, and robust I/O in a compact surface‑mount 1152‑BBGA package.

Key Features

  • Core Logic — 480,000 logic elements (cells) provide a high level of programmable logic capacity for complex control, signal processing, and custom acceleration tasks.
  • Embedded Memory — 5,664,768 total RAM bits available in on‑chip memory blocks for buffering, look‑up tables, and data storage close to logic.
  • I/O and High‑Speed Interfaces — 396 user I/Os and Arria 10 GX series support for PCIe Gen1/Gen2/Gen3 hard IP, low‑power serial transceivers, Interlaken and 10 Gbps Ethernet enable high‑bandwidth external connectivity.
  • DSP and Processing — Variable‑precision DSP blocks and optional SoC hard processor system capabilities (Arria 10 family features) support compute‑intensive signal processing and algorithm acceleration.
  • Power and Voltage — Supports a core voltage supply range of 870 mV to 930 mV and incorporates Arria 10 series power‑saving technologies for improved efficiency in power‑sensitive designs.
  • Package, Mounting and Thermal — Surface‑mount 1152‑BBGA (1152‑FBGA, FC 35×35) package; industrial operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Configuration and Reliability — Device family capabilities include dynamic and partial reconfiguration and SEU error detection and correction mechanisms for resilient operation and flexible design updates.
  • Compliance — RoHS compliant material status for regulatory and manufacturing alignment.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and high‑speed serdes are required.
  • Wireline Networking — 40G/100G muxponders, transponders and line cards that need high‑bandwidth interfaces, PCIe support and protocol processing.
  • Broadcast and Media — Studio switches, video transport and professional audio/video processing that benefit from large on‑chip memory and DSP resources.
  • Computing and Storage — Server acceleration, flash cache and cloud computing applications that require configurable logic and high I/O density for custom offload functions.
  • Medical and Defense Systems — Diagnostic imaging, radar and electronic warfare subsystems that require deterministic processing, reconfigurability and industrial temperature operation.

Unique Advantages

  • High Logic Density: 480,000 logic elements enable integration of complex custom logic and accelerators on a single device, reducing BOM and board area.
  • Substantial On‑Chip RAM: Nearly 5.7 million RAM bits support large buffers, packet memory and real‑time data storage without external DRAM for many functions.
  • Advanced Connectivity: 396 I/Os combined with Arria 10 GX high‑speed serial and protocol hard IP options streamline implementation of high‑speed links and standard interfaces.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions common to industrial and communications equipment.
  • Low‑Voltage Core Operation: 870–930 mV supply range aligns with modern power‑optimized system designs, enabling efficient power delivery and thermal profiles.
  • Documented Ecosystem: Backed by Arria 10 device documentation, errata and design resources that support development, debugging and qualification activities.

Why Choose 10AX048K3F35I2LG?

The 10AX048K3F35I2LG Arria 10 GX FPGA combines high programmable logic capacity, ample embedded memory and extensive I/O to address mid‑range applications that require performance and flexibility. Its industrial temperature rating and surface‑mount 1152‑BBGA package make it suitable for compact, robust system designs.

This device is well suited for designers building wireless and wireline infrastructure, professional media equipment, compute acceleration and specialized medical or defense instruments who need reconfigurable hardware, high‑speed connectivity and support resources from the Arria 10 device family documentation.

Request a quote or submit an inquiry for 10AX048K3F35I2LG to start your procurement or design evaluation. Include the part number and your expected volumes or application details to expedite response.

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