10AX057K2F40I2SG

IC FPGA 696 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 42082304 570000 1517-BBGA, FCBGA

Quantity 697 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K2F40I2SG – Arria 10 GX FPGA, 570,000 logic elements, 1517‑FCBGA

The 10AX057K2F40I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) device offering high logic capacity and extensive on‑chip memory in a compact 1517‑FCBGA (40×40) package. It is part of the Arria 10 device family of 20‑nm mid‑range FPGAs designed for performance and power efficiency across communications, broadcast, computing, medical, and defense applications.

This device is specified for industrial use with an operating temperature range of −40 °C to 100 °C and a supply voltage window of 870 mV to 980 mV. It provides a large number of I/O and integrated architectural features for system‑level integration and high‑throughput designs.

Key Features

  • Logic Capacity – 570,000 logic elements to support complex, high‑density digital designs.
  • Embedded Memory – 42,082,304 total RAM bits of on‑chip memory for buffering, caching, and on‑chip data storage.
  • I/O Density – 696 user I/O pins to support wide external connectivity and multiple high‑speed interfaces.
  • Package – 1517‑BBGA / 1517‑FCBGA (40×40) surface‑mount package for high pin‑count, compact board layouts.
  • Industrial Temperature and Grade – Industrial grade device rated for −40 °C to 100 °C operation.
  • Power Supply – Core supply specified between 870 mV and 980 mV for predictable power planning.
  • High‑Level Architectural Features – Family features include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks with PLL sources, and support for dynamic and partial reconfiguration.
  • High‑Speed Interfaces & IP – Arria 10 devices include PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers (as described for the Arria 10 family).
  • System Integration Options – Family documentation references SoC integration options with a hard processor system and configuration/boot features for complex systems.
  • Reliability & Manageability – Device family includes features for SEU error detection and correction, power management, and incremental compilation support.

Typical Applications

  • Wireless Infrastructure – Channel and switch cards, remote radio head processing, and mobile backhaul designs that require high logic density and on‑chip memory.
  • Wireline Transport & Switching – 40G/100G muxponders, transponders and line cards where high‑speed serial interfaces and PCIe hard IP enable protocol handling and packet processing.
  • Broadcast & Professional Video – Studio switches, transport, and videoconferencing equipment leveraging large memory and I/O count for multi‑stream handling.
  • Computing & Storage Acceleration – Flash cache, server acceleration, and cloud compute offload that benefit from the device's logic capacity and embedded RAM.
  • Medical & Defense Electronics – Diagnostic imaging, radar, and secure communications systems where industrial temperature operation and system reliability features are required.

Unique Advantages

  • High Logic Density: 570,000 logic elements provide the capacity to implement large, complex FPGA designs without partitioning across multiple devices.
  • Substantial On‑Chip Memory: Over 42 million RAM bits enable large buffers, frame storage, and data‑intensive processing on a single device.
  • Extensive I/O Capability: 696 I/O pins allow broad external connectivity for multi‑lane interfaces, parallel buses, and mixed I/O systems.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C to support ruggedized and industrial applications.
  • Compact, High‑Pin Package: 1517‑FCBGA (40×40) packaging balances pin count and board space for dense system designs.
  • Family‑Level IP and Features: Arria 10 family support for PCIe, Ethernet, low‑power transceivers, DSP blocks, and reconfiguration features simplifies system integration and IP reuse.

Why Choose 10AX057K2F40I2SG?

The 10AX057K2F40I2SG positions itself as a high‑capacity, power‑aware solution within the Intel Arria 10 family, combining large logic and memory resources with strong I/O and packaging for compact system designs. Its industrial temperature rating and defined core voltage range make it suitable for demanding embedded and infrastructure applications that require predictable electrical and thermal behavior.

This device is well suited to engineers and system designers building mid‑range, performance‑sensitive applications that need significant on‑chip resources and family‑level integration features. Backed by Arria 10 family documentation and device-level features, it offers scalability and architectural options useful throughout product development and deployment.

Request a quote or submit an inquiry to receive pricing and availability information for the 10AX057K2F40I2SG. Our team can provide lead‑time details and help evaluate the device for your design requirements.

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