10AX057K3F35E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 42082304 570000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,341 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 217080 | Number of Logic Elements/Cells | 570000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 42082304 |
Overview of 10AX057K3F35E2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX057K3F35E2LG is an Intel Arria 10 GX family FPGA in a 1152-FCBGA (35×35) package, designed for mid-range, high-performance, power-efficient programmable logic applications. It combines a large logic fabric with substantial on-chip memory and high I/O density to address demanding data-path, networking, and signal-processing tasks.
Built on the Arria 10 device architecture, this device targets markets such as wireless and wireline communications, broadcast, computing and storage, and advanced imaging, providing a balance of performance and power efficiency for system designs that require significant integration and flexibility.
Key Features
- Logic Capacity — 570,000 logic elements (cells) for implementing complex digital functions and large-scale custom logic.
- Embedded Memory — 42,082,304 total RAM bits to support large on-chip buffers, packet processing, and data staging without immediate external memory dependence.
- I/O and Packaging — 396 I/O pins in a 1152-FCBGA (35×35) surface-mount package, enabling high pin-count, board-level connectivity in a compact footprint.
- Low-Voltage Core — Core voltage supply range 870 mV to 930 mV, consistent with Arria 10 device power domains for efficient core operation.
- Thermal and Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployments requiring elevated ambient tolerance.
- Architecture-Level Features — Arria 10 family capabilities included in the device overview: adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, and support for dynamic/partial reconfiguration.
- High-Speed Interfaces — Device overview lists PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed link integration.
- System Reliability and Power — Documentation notes SEU error detection and correction features, power management technologies, and incremental compilation support mentioned for the Arria 10 family.
- Regulatory Status — RoHS compliant.
Typical Applications
- Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul systems that benefit from high logic density and on-chip memory.
- Wireline Networking — 40G/100G muxponders, transponders, and line cards where high-speed serial transceivers and PCIe/ethernet hard IP accelerate protocol connectivity.
- Broadcast and Professional AV — Studio switches, video transport and processing pipelines that require dense logic, large buffering, and flexible I/O mapping.
- Computing and Storage Acceleration — Server acceleration, flash cache controllers and cloud compute offload where abundant logic and memory enable custom dataplane implementations.
- Medical and Imaging — Diagnostic imaging and scanner subsystems that need programmable signal processing and large on-chip memory for real-time data handling.
Unique Advantages
- High Logic Density: 570,000 logic elements provide headroom for complex algorithms, accelerators, and large custom datapaths on a single device.
- Substantial On-Chip Memory: Over 42 million RAM bits reduce external memory dependency for many buffering and preprocessing tasks, simplifying board-level design.
- Rich I/O in a Compact Package: 396 I/Os in a 1152-FCBGA (35×35) surface-mount package enable dense connectivity while preserving a relatively compact PCB footprint.
- Power-Aware Core Voltage: 870 mV–930 mV core supply supports the Arria 10 family’s power management features for energy-efficient operation.
- Extended Operating Range: 0 °C–100 °C grade provides capability for higher ambient operating conditions compared to standard commercial-only ranges.
- Documented Platform Ecosystem: The Arria 10 device family is accompanied by device overview and handbook documentation, including design recommendations and errata references to support reliable development.
Why Choose 10AX057K3F35E2LG?
The 10AX057K3F35E2LG delivers a balance of high logic capacity, large embedded memory, and broad I/O capability in an Arria 10 GX device package tailored for mid-range, high-performance applications. Its architecture and listed family features—DSP blocks, clocking resources, hard protocol IP, and transceiver support—make it suitable for system designs that require significant on-chip compute and flexible high-speed interfaces.
This device is well suited for engineers and procurement teams building networking, broadcast, compute-acceleration, and imaging systems that need scalable programmable logic, integrated memory resources, and documented Arria 10 platform guidance for development and deployment.
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