10AX057K3F35E2LG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 42082304 570000 1152-BBGA, FCBGA

Quantity 1,341 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs217080Number of Logic Elements/Cells570000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits42082304

Overview of 10AX057K3F35E2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX057K3F35E2LG is an Intel Arria 10 GX family FPGA in a 1152-FCBGA (35×35) package, designed for mid-range, high-performance, power-efficient programmable logic applications. It combines a large logic fabric with substantial on-chip memory and high I/O density to address demanding data-path, networking, and signal-processing tasks.

Built on the Arria 10 device architecture, this device targets markets such as wireless and wireline communications, broadcast, computing and storage, and advanced imaging, providing a balance of performance and power efficiency for system designs that require significant integration and flexibility.

Key Features

  • Logic Capacity — 570,000 logic elements (cells) for implementing complex digital functions and large-scale custom logic.
  • Embedded Memory — 42,082,304 total RAM bits to support large on-chip buffers, packet processing, and data staging without immediate external memory dependence.
  • I/O and Packaging — 396 I/O pins in a 1152-FCBGA (35×35) surface-mount package, enabling high pin-count, board-level connectivity in a compact footprint.
  • Low-Voltage Core — Core voltage supply range 870 mV to 930 mV, consistent with Arria 10 device power domains for efficient core operation.
  • Thermal and Grade — Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployments requiring elevated ambient tolerance.
  • Architecture-Level Features — Arria 10 family capabilities included in the device overview: adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, and support for dynamic/partial reconfiguration.
  • High-Speed Interfaces — Device overview lists PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-speed link integration.
  • System Reliability and Power — Documentation notes SEU error detection and correction features, power management technologies, and incremental compilation support mentioned for the Arria 10 family.
  • Regulatory Status — RoHS compliant.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul systems that benefit from high logic density and on-chip memory.
  • Wireline Networking — 40G/100G muxponders, transponders, and line cards where high-speed serial transceivers and PCIe/ethernet hard IP accelerate protocol connectivity.
  • Broadcast and Professional AV — Studio switches, video transport and processing pipelines that require dense logic, large buffering, and flexible I/O mapping.
  • Computing and Storage Acceleration — Server acceleration, flash cache controllers and cloud compute offload where abundant logic and memory enable custom dataplane implementations.
  • Medical and Imaging — Diagnostic imaging and scanner subsystems that need programmable signal processing and large on-chip memory for real-time data handling.

Unique Advantages

  • High Logic Density: 570,000 logic elements provide headroom for complex algorithms, accelerators, and large custom datapaths on a single device.
  • Substantial On-Chip Memory: Over 42 million RAM bits reduce external memory dependency for many buffering and preprocessing tasks, simplifying board-level design.
  • Rich I/O in a Compact Package: 396 I/Os in a 1152-FCBGA (35×35) surface-mount package enable dense connectivity while preserving a relatively compact PCB footprint.
  • Power-Aware Core Voltage: 870 mV–930 mV core supply supports the Arria 10 family’s power management features for energy-efficient operation.
  • Extended Operating Range: 0 °C–100 °C grade provides capability for higher ambient operating conditions compared to standard commercial-only ranges.
  • Documented Platform Ecosystem: The Arria 10 device family is accompanied by device overview and handbook documentation, including design recommendations and errata references to support reliable development.

Why Choose 10AX057K3F35E2LG?

The 10AX057K3F35E2LG delivers a balance of high logic capacity, large embedded memory, and broad I/O capability in an Arria 10 GX device package tailored for mid-range, high-performance applications. Its architecture and listed family features—DSP blocks, clocking resources, hard protocol IP, and transceiver support—make it suitable for system designs that require significant on-chip compute and flexible high-speed interfaces.

This device is well suited for engineers and procurement teams building networking, broadcast, compute-acceleration, and imaging systems that need scalable programmable logic, integrated memory resources, and documented Arria 10 platform guidance for development and deployment.

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