10AX066H1F34E1SG

The 10AX066H1F34E1SG is an Intel Arria 10 GX FPGA in a 1152‑FCBGA package, offering high logic capacity and large on‑chip memory for midrange, performance‑sensitive designs. It is part of the Arria 10 device family, a 20‑nm portfolio focused on higher performance and improved power efficiency for diverse markets.

This device provides 660,000 logic elements, 49,610,752 total RAM bits and 492 I/O pins in a compact 1152‑FCBGA (35×35) surface‑mount package, with an operating voltage range of 870 mV to 980 mV and an operating temperature of 0 °C to 100 °C. The part is graded Extended and is RoHS compliant.

Key Features

• Core & Logic Capacity  660,000 logic elements (logic cells) provide substantial programmable fabric for complex designs and midrange system integration.
• Embedded Memory  49,610,752 total RAM bits on‑chip to support large buffering, caching, and data‑intensive functions without external memory for many tasks.
• I/O Density  492 I/O pins deliver flexible connectivity for high‑pin‑count interfaces and multi‑channel designs.
• Package & Mounting  1152‑FCBGA (35×35) surface‑mount package balances high pin count and a compact board footprint for space‑constrained systems.
• Power Supply Range  Specified operating core voltage from 870 mV to 980 mV to align with system power rails and power‑management strategies.
• Operating Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C to suit a variety of controlled‑environment applications.
• Compliance  RoHS compliant.
• Arria 10 Family Capabilities  As part of the Arria 10 family, the device benefits from the family’s architecture and feature set, which the datasheet lists as focused on higher performance, power efficiency, and support for high‑speed serial and protocol features across the portfolio.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul implementations where midrange performance and on‑chip resources accelerate signal processing.
• Wireline Networking  40G/100G muxponders, transponders and line cards where high logic density and abundant I/O support packet handling and interface aggregation.
• Broadcast & Media  Studio switches, videoconferencing and professional audio/video equipment leveraging the device’s memory and logic for media processing and routing.
• Computing & Storage  Flash cache, server acceleration and cloud infrastructure designs that benefit from the device’s logic and embedded RAM for offload and caching tasks.
• Medical & Industrial Systems  Diagnostic imaging and scanner control that require programmable logic capacity combined with on‑chip memory and flexible I/O.

Unique Advantages

• High Logic Density: 660,000 logic elements enable integration of complex algorithms and multiple functions on a single device, reducing system BOM.
• Large On‑Chip Memory: Nearly 50 million bits of RAM reduce dependence on external memory for many buffering and data‑path requirements.
• Extensive I/O: 492 I/Os provide the pin count needed for multi‑lane interfaces and parallel front‑end connectivity.
• Compact, High‑Pin Package: 1152‑FCBGA (35×35) delivers high I/O in a compact footprint for dense board designs.
• Platform Continuity: As part of the Arria 10 family, designs can take advantage of a consistent device architecture focused on performance and power efficiency.
• Compliance & Grade: RoHS compliance and Extended device grade support procurement and deployment in controlled‑environment commercial and industrial systems.

Why Choose 10AX066H1F34E1SG?

The 10AX066H1F34E1SG delivers a blend of programmable logic capacity, substantial embedded RAM, and high I/O count in a compact FCBGA package—making it well suited for midrange, performance‑sensitive applications across communications, broadcast, compute acceleration and medical imaging. Its inclusion in the Arria 10 family ties it to a device line focused on higher performance and power efficiency.

For system designers and procurement teams seeking a high‑capacity, RoHS‑compliant FPGA with extended grade temperature support and a compact 1152‑FCBGA footprint, this part offers a clear, verifiable specification set to evaluate against project requirements.

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