10AX066K1F40E1HG

The 10AX066K1F40E1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) packaged in a 1517-BBGA (FCBGA) surface-mount device. It delivers a high-density fabric with 660,000 logic elements and 49,610,752 total RAM bits for mid-range, performance-sensitive designs.

Built on the Arria 10 device family, this FPGA targets applications across wireless, wireline, broadcast, computing and storage, and other markets that require a balance of performance and power efficiency, with extended-grade temperature capability.

Key Features

• Logic Capacity  660,000 logic elements (cells) to implement complex digital designs and high-density FPGA functions.
• Embedded Memory  49,610,752 total RAM bits of on-chip memory to support buffering, packet processing, and data-intensive algorithms.
• I/O and High-Speed Connectivity  696 general-purpose I/O pins; device-level support information in the Arria 10 family includes PCIe Gen1/Gen2/Gen3 hard IP, transceiver channels and 10 Gbps Ethernet support as described in the device overview.
• DSP and Arithmetic  Variable-precision DSP block architecture is documented for the Arria 10 family to support signal processing and compute-intensive operations.
• Clocking and PLLs  Comprehensive clock networks and fractional synthesis / I/O PLL options are part of the Arria 10 device featureset for flexible timing architectures.
• Power Supply Range  Supply voltage range 870 mV to 980 mV, enabling designs that require specific core-voltage operation.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40) for surface-mount assembly.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C; RoHS compliant.

Typical Applications

• Wireless infrastructure  Channel and switch cards, and mobile backhaul systems that require high-density logic and flexible DSP resources.
• Wireline networking  Multiplexing and transponder line cards, 40G/100G applications and network aggregation where on-chip memory and high-speed I/O are needed.
• Broadcast and Pro AV  Studio switching, video transport and professional audio/video processing leveraging large embedded memory and DSP capabilities.
• Computing and Storage  Server acceleration and flash cache applications that benefit from high logic density and embedded RAM for caching and packet processing.
• Medical and Defense  Diagnostic imaging, radar and secure communications applications that use the device’s combination of logic, memory and transceiver features.

Unique Advantages

• High logic density: 660,000 logic elements provide capacity for large, complex FPGA designs without immediate migration to larger device families.
• Large embedded memory: Nearly 50 Mbit of on-chip RAM supports buffering and data-path requirements, reducing dependency on external memory for many use cases.
• Comprehensive connectivity: 696 I/O pins combined with Arria 10 family transceiver and PCIe hard IP options enable diverse high-speed interface implementations.
• Flexible clocking: Documented clock networks and PLL capabilities in the Arria 10 family support complex timing domains and fractional synthesis requirements.
• Compact surface-mount package: 1517-BBGA (1517-FBGA, 40×40) packaging provides a high-density, board-space-efficient solution for system integration.
• Extended-grade operation: 0 °C to 100 °C operating range and RoHS compliance make the device suitable for a wide set of commercial and ruggedized deployments.

Why Choose 10AX066K1F40E1HG?

This Arria 10 GX FPGA combines high logic capacity, large on-chip memory and extensive I/O to address mid-range applications that need a balance of performance and power efficiency. The device’s documented Arria 10 family features—variable-precision DSP blocks, robust clocking resources, and high-speed connectivity options—support a wide variety of signal processing, networking and compute-acceleration designs.

Designed for engineers and system designers seeking scalability and integration, the 10AX066K1F40E1HG is well suited to projects that require dense logic, significant embedded RAM, and a compact FCBGA package while maintaining extended-grade temperature performance.

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