10AX066K1F40E1SG

IC FPGA 696 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 49610752 660000 1517-BBGA, FCBGA

Quantity 272 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K1F40E1SG – Arria 10 GX FPGA, 1517-FCBGA (40×40)

The 10AX066K1F40E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) offered in a 1517-FCBGA surface-mount package. It is part of the Arria 10 device family—20 nm mid-range FPGAs that emphasize higher performance and power efficiency for a range of system applications.

This device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where a combination of high logic density, significant embedded memory, and broad I/O capability are required.

Key Features

  • Logic Density  Provides 660,000 logic elements (cells) to support complex signal processing, control, and compute tasks.
  • On‑Chip Memory  Total embedded RAM of 49,610,752 bits for buffering, packet processing, and data staging within the FPGA fabric.
  • I/O Capacity  Up to 696 I/O pins to support dense board-level connectivity and high-pin-count interfaces.
  • Power Supply Range  Core supply voltage specification between 870 mV and 980 mV for alignment with system power budgets.
  • Package and Mounting  1517-BBGA (FCBGA) supplier package (1517-FCBGA, 40×40); surface-mount mounting for modern PCB assembly flows.
  • Temperature Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for thermally demanding application environments.
  • Arria 10 Family Capabilities  Device family features include adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for high-speed Ethernet/Interlaken, and low-power serial transceivers (as described for Arria 10 devices).

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems where high logic density and I/O count enable advanced PHY and MAC implementations.
  • Wireline Networking  40G/100G muxponders, transponders, and line cards leveraging embedded memory and transceiver capabilities for packet aggregation and high-speed data transport.
  • Broadcast and AV  Studio switches, transport and conferencing equipment requiring flexible I/O, large on-chip RAM, and programmable logic for real-time video processing.
  • Computing & Storage  Server acceleration and flash-cache applications that use the programmable fabric and DSP resources to implement custom acceleration kernels.

Unique Advantages

  • High Logic Capacity: 660,000 logic elements enable implementation of complex control, signal processing, and custom compute functions without external ASICs.
  • Substantial On‑Chip Memory: Nearly 50 Mbit of embedded RAM supports large buffers, FIFOs, and on-chip data processing to reduce external memory bandwidth needs.
  • Extensive I/O: 696 available I/Os make the device suitable for dense interface requirements and multi-protocol board designs.
  • Family-Level High‑Speed Interfaces: Arria 10 family support for PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS for 10 Gbps Ethernet/Interlaken simplifies integration of common networking protocols.
  • Power and Thermal Flexibility: Defined core voltage range (870–980 mV) and extended operating temperature (0 °C–100 °C) allow tuning for system power profiles and thermal envelopes.
  • Surface‑Mount Package: 1517-FCBGA (40×40) packaging supports modern PCB assembly and thermal management strategies for compact high-density designs.

Why Choose 10AX066K1F40E1SG?

The 10AX066K1F40E1SG Arria 10 GX FPGA combines high logic density, large on‑chip memory, and extensive I/O in a surface-mount FCBGA package designed for mid-range, performance-sensitive applications. Its device-family capabilities—such as DSP resources, clocking and PLL options, hard PCIe IP, and high-speed serial support—allow engineers to implement complex, protocol-rich designs while managing power and board-level integration.

This Arria 10 GX device is well suited to development teams and OEMs building wireless infrastructure, high-speed networking equipment, broadcast/video systems, and compute acceleration solutions who need programmable, scalable hardware with documented Arria 10 device capabilities and extended-grade operating ranges.

If you would like pricing or availability for the 10AX066K1F40E1SG, request a quote or submit an RFQ and our team will respond with technical and commercial details.

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