10AX066K2F35E1SG

The 10AX066K2F35E1SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑FBGA (35×35) surface‑mount package. It combines a high logic cell count with substantial on‑chip RAM and a wide I/O set for midrange, performance‑sensitive designs.

As part of the Arria 10 family of 20 nm devices, the part targets markets such as wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and defense applications where higher performance and power efficiency are important design considerations.

Key Features

• High Logic Capacity — 660,000 logic elements to implement complex digital functions and large FPGA designs.
• Large On‑Chip Memory — 49,610,752 total RAM bits for data buffering, packet processing, and embedded storage.
• Rich I/O — 492 user I/O pins to support broad external interfaces and high pin‑count systems integration.
• Package and Mounting — 1152‑FCBGA (35×35) surface‑mount package suitable for high‑density board designs.
• Power and Supply — Core voltage range 870 mV to 980 mV, enabling low‑voltage operation in power‑sensitive designs.
• Operating Grade and Temperature — Extended grade with an operating range of 0 °C to 100 °C for deployments requiring wider ambient tolerance.
• Arria 10 Family Technologies — Built on the Arria 10 device architecture, which emphasizes higher performance and power efficiency and includes family features such as variable‑precision DSP blocks, embedded memory blocks, and advanced clocking and PLL options.

Typical Applications

• Wireless Infrastructure — Remote radio heads, channel and switch cards, and mobile backhaul systems that require significant digital processing and I/O connectivity.
• Wireline and Networking — 40G/100G muxponders, transponders, line cards and aggregation equipment leveraging high logic density and on‑chip memory.
• Broadcast and Professional AV — Studio switches and transport systems that need flexible I/O and on‑fpga data buffering.
• Compute and Storage Acceleration — Flash cache, server acceleration, and cloud compute applications that benefit from integrated logic and memory resources.
• Medical and Defense Systems — Diagnostic imaging, radar, and electronic warfare subsystems where performance and power efficiency are required.

Unique Advantages

• High integration density: 660,000 logic elements enable consolidation of complex functions onto a single device, reducing board BOM and interconnect complexity.
• Substantial embedded memory: Nearly 50 Mbits of on‑chip RAM supports large buffers, packet queues, and state storage without immediate dependence on external memory.
• Wide I/O capability: 492 I/O pins provide flexibility for multiple external interfaces and high‑speed signaling schemes.
• Compact FCBGA package: 1152‑FCBGA (35×35) offers a high pin count in a compact footprint for space‑constrained, high‑density PCBs.
• Low core voltage operation: 870–980 mV supply range supports optimized power profiles for power‑sensitive applications.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to meet broader ambient requirements compared to standard commercial ranges.

Why Choose 10AX066K2F35E1SG?

The 10AX066K2F35E1SG positions itself as a high‑capacity, midrange FPGA that balances substantial logic and memory resources with a wide I/O count and compact FCBGA packaging. Its inclusion in the Arria 10 family brings device‑level features oriented toward higher performance and improved power efficiency, making it suitable for communications, broadcast, compute acceleration, imaging, and defense applications.

Designers seeking a scalable, integrated FPGA solution with significant on‑chip RAM, extensive I/O, and extended operating temperature support will find this device capable of consolidating multiple system functions while addressing power and board‑space constraints.

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