10AX066K2F35E2LG

The 10AX066K2F35E2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152-FCBGA (35×35) package. It is a 20 nm mid-range FPGA/SoC-class device that delivers a balance of logic capacity, embedded memory, and I/O density for performance- and power-sensitive applications.

Designed for markets such as wireless, wireline, broadcast, computing and storage, and medical imaging, this extended-grade device targets systems that require large logic resources, high embedded RAM capacity, and extensive I/O in a compact surface-mount package.

Key Features

• Logic Capacity — 660,000 logic elements enable complex programmable logic implementations and large-scale custom acceleration.
• Embedded Memory — 49,610,752 total RAM bits provide on-chip storage for buffering, caching, and intermediate data processing close to logic.
• I/O Density — 396 I/O pins support diverse interface requirements and high-pin-count system designs.
• Package and Mounting — 1152-FCBGA (35×35) package in a surface-mount form factor for high-density board integration.
• Power — Supported core voltage range of 870 mV to 980 mV for targeted power domains and controlled power budgeting.
• Operating Range & Grade — Extended-grade device rated for 0 °C to 100 °C operation.
• Family-Level Capabilities — Part of the Intel Arria 10 family, a 20 nm mid-range FPGA/SoC platform with features such as variable-precision DSP blocks, embedded memory blocks, and low-power serial transceivers (family-level details referenced from the Arria 10 device overview).
• Compliance — RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device’s logic and I/O resources.
• Wireline Networking — 40G/100G muxponders, transponders, and line cards where on-chip memory and programmable logic accelerate packet processing and bridging.
• Broadcast and AV — Studio switching and professional audio/video transport applications that benefit from high I/O density and embedded RAM for buffering.
• Computing and Storage — Flash cache, server acceleration, and cloud compute assist functions that use large logic and memory resources for custom data-paths.
• Medical Imaging — Diagnostic imaging and scanner subsystems that require substantial on-chip memory and programmable compute for real-time data handling.

Unique Advantages

• High integration density: 660,000 logic elements plus nearly 50 million RAM bits reduce the need for external FPGA companion devices and external memory in many designs.
• Extensive I/O support: 396 I/Os provide flexibility for multiple parallel interfaces and high-pin-count mezzanine or backplane connections.
• Compact, manufacturable package: 1152-FCBGA (35×35) surface-mount package enables space-efficient PCB layouts without compromising connectivity.
• Extended operating range: 0 °C to 100 °C rating and Extended grade classification help address systems that operate in wider commercial temperature envelopes.
• Power domain control: Core voltage support from 870 mV to 980 mV enables targeted power provisioning for system-level energy optimization.
• Proven family platform: As part of the Intel Arria 10 family, the device inherits platform-level features such as DSP blocks, embedded memory architectures, and serial transceiver capabilities documented in the Arria 10 overview.

Why Choose 10AX066K2F35E2LG?

The 10AX066K2F35E2LG provides a large programmable fabric and substantial embedded memory in a compact 1152-FCBGA package, suited to mid-range FPGA applications that require both compute density and I/O breadth. Its extended-grade rating and defined operating voltage range make it appropriate for commercial and industrial-adjacent systems needing reliable, on-board programmable logic.

Engineers developing wireless infrastructure, high-speed wireline systems, broadcast equipment, compute acceleration, or medical imaging can leverage the Arria 10 GX architecture and on-chip resources to consolidate functions, reduce external component count, and accelerate time-to-market while staying within predictable power and thermal envelopes.

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