10AX066K2F35I1HG

IC FPGA 492 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 492 49610752 660000 1152-BBGA, FCBGA

Quantity 708 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O492Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K2F35I1HG – Arria 10 GX FPGA, 660,000 Logic Elements, 1152‑FCBGA

The 10AX066K2F35I1HG is an industrial-grade Arria 10 GX field programmable gate array (FPGA) in a 1152‑FCBGA (35×35) package. It combines a large programmable fabric with extensive on-chip memory and high-speed serial/PCIe capabilities for midrange, performance-sensitive applications.

Designed for applications that require high logic density, embedded RAM, and a wide set of I/O and transceiver options, this device targets markets such as wireless, wireline, broadcast, computing and storage, and advanced medical and defense systems.

Key Features

  • Core Logic  660,000 logic elements provide large-scale programmable logic capacity for complex digital designs.
  • Embedded Memory  49,610,752 total RAM bits available on-chip to support buffering, packet processing, and large LUTs without external memory.
  • I/O & Package  492 user I/Os in a surface-mount 1152‑FCBGA (35×35) package for dense board-level integration.
  • High-Speed Interfaces  Series-level support for PCIe Gen1/Gen2/Gen3 hard IP and 10 Gbps Ethernet, plus low-power serial transceivers and advanced PCS/PMA features suitable for high-bandwidth links.
  • DSP & Processing Blocks  Variable-precision DSP blocks enable configurable signal-processing pipelines for algorithms requiring flexible arithmetic precision.
  • Clocking & Reconfiguration  Comprehensive clock networks with fractional synthesis and I/O PLLs, plus support for dynamic and partial reconfiguration for in-field flexibility.
  • Power and Supply  Operates from a core supply range of 870 mV to 980 mV and incorporates series-level power-efficiency design elements.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Compliance  RoHS-compliant for environmental regulatory requirements.

Typical Applications

  • Wireless Infrastructure  Channel cards, switch cards, and mobile backhaul systems using the device’s high logic capacity and transceiver features for baseband and PHY implementations.
  • Wireline & Optical Transport  40G/100G muxponders, transponders, and line cards leveraging PCIe and high-speed serial capabilities for packet aggregation and line-rate processing.
  • Broadcast & Media  Studio switches and professional audio/video equipment that benefit from large on-chip RAM and flexible DSP blocks for real-time media processing.
  • Computing & Storage Acceleration  Flash cache, server acceleration, and cloud compute offload where dense logic and memory reduce external component count.
  • Medical & Defense Systems  Diagnostic imaging, radar, and guidance systems that require deterministic logic performance and extended operating temperature range.

Unique Advantages

  • High Logic Density: 660,000 logic elements provide the headroom to consolidate complex functions into a single FPGA, simplifying board-level design.
  • Substantial On-Chip Memory: Nearly 50 Mbits of embedded RAM reduce reliance on external memory for buffering and stateful processing.
  • Integrated High-Speed I/O: 492 I/Os and series-level PCIe/10 Gbps Ethernet support enable direct connection to high-bandwidth peripherals and fabrics.
  • Flexible DSP Resources: Variable-precision DSP blocks allow designers to trade precision for throughput or efficiency as needed by the algorithm.
  • Rugged Industrial Operation: Rated for −40 °C to 100 °C and RoHS-compliant, supporting deployment in temperature- and regulation-sensitive environments.
  • Compact, Surface-Mount Package: 1152‑FCBGA (35×35) package enables dense PCB implementations while maintaining the interface count required for complex systems.

Why Choose 10AX066K2F35I1HG?

The 10AX066K2F35I1HG balances high logic capacity, extensive embedded memory, and robust high-speed interface support in an industrial-grade FPGA package. It is positioned for midrange applications that require both performance and integration—reducing BOM complexity while enabling scalable designs.

Customers designing wireless infrastructure, high-speed networking, broadcast systems, compute/storage accelerators, or advanced medical and defense electronics will find the combination of logic density, on-chip RAM, and transceiver/IP capabilities valuable for long-term product development and deployment.

Request a quote or submit an inquiry to get pricing and availability for the 10AX066K2F35I1HG Arria 10 GX FPGA. Our team can assist with lead times, packaging options, and order placement.

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