10AX066K2F35I2SG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA

Quantity 497 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K2F35I2SG – Arria 10 GX FPGA, 660,000 logic elements, 49,610,752-bit RAM, 396 I/O

The 10AX066K2F35I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm process. It combines high logic density, substantial embedded memory, and a wide I/O complement in a 1152-FCBGA (35 × 35 mm) surface-mount package.

This device is positioned for mid-range, performance-sensitive applications across markets such as wireless, wireline, broadcast, computing and storage, medical, and defense where programmable logic, on-chip memory, and flexible I/O are required under industrial temperature conditions.

Key Features

  • Logic Capacity  660,000 logic elements provide the resources needed for complex digital designs and high-integration system functions.
  • Embedded Memory  49,610,752 total RAM bits enable large on-chip buffering, FSM state storage, and data-path memory for packet, image, or signal processing.
  • I/O Density  396 user I/O pins support broad connectivity to external devices, memory, and high-speed lanes.
  • Process and Architecture  20 nm Arria 10 GX architecture offers a balance of performance and power efficiency for mid-range FPGA applications.
  • Power Supply  Specified core voltage range of 0.870 V to 0.980 V for core power domains.
  • Package and Mounting  1152-FCBGA (35 × 35 mm) package, surface-mount mounting type suited for compact board designs.
  • Operating Range  Industrial temperature grade with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
  • Standards and IP  Device family documentation highlights integrated features such as PCIe Gen1/Gen2/Gen3 hard IP, clock networks and PLLs, variable-precision DSP blocks, and low-power serial transceivers (as detailed in the Arria 10 family overview).
  • RoHS Compliant  Meets RoHS environmental compliance requirements.

Typical Applications

  • Wireless Infrastructure  Channel processing and baseband functions where programmable data-paths and on-chip memory accelerate PHY and MAC implementations.
  • Wireline and Telecom  Line cards, muxponders, and aggregation equipment that require high logic capacity and integrated hard IP blocks for Ethernet and interconnect protocols.
  • Broadcast and Professional AV  Studio switching, video transport, and transcoding systems using on-chip RAM and logic to handle real-time media streams.
  • Compute and Storage Acceleration  Flash cache, server offload, and custom acceleration tasks that benefit from large embedded memory and dense logic for algorithmic pipelines.
  • Medical and Industrial Systems  Diagnostic imaging and control equipment where industrial temperature range and programmable logic enable tailored signal processing and interfacing.

Unique Advantages

  • High logic density: 660,000 logic elements enable integration of complex control, DSP, and protocol layers on a single device, reducing system BOM and board-level complexity.
  • Substantial on-chip memory: Nearly 50 Mbits of RAM supports large buffers and local data storage, minimizing dependency on external memory for many designs.
  • Flexible connectivity: 396 I/O pins and Arria 10 family I/O/PHY features support diverse external interfaces and high-speed serial links where required.
  • Industrial temperature rating: −40 °C to 100 °C operation broadens deployment options for harsh or regulated environments.
  • Compact, manufacturable package: 1152-FCBGA (35 × 35 mm) surface-mount package enables dense board layouts while supporting production assembly.
  • Power-scalable core: Operates across a defined core voltage window (0.870–0.980 V) to support controlled-power designs and system power management strategies.

Why Choose 10AX066K2F35I2SG?

The 10AX066K2F35I2SG delivers a balance of logic capacity, embedded memory, and I/O flexibility in a 20 nm Arria 10 GX device, making it suited to mid-range applications that require programmable performance and on-chip integration. Its industrial temperature rating and RoHS compliance make it appropriate for a broad set of deployments where environmental range and regulatory compliance are considerations.

As part of the Arria 10 family, this device aligns with documented IP and system features such as DSP blocks, PLLs, PCIe hard IP, and low-power serial transceivers, allowing engineering teams to leverage device capabilities while scaling designs across the Arria 10 portfolio.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 10AX066K2F35I2SG.

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