10AX066K2F35I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 497 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K2F35I2SG – Arria 10 GX FPGA, 660,000 logic elements, 49,610,752-bit RAM, 396 I/O
The 10AX066K2F35I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) device built on a 20 nm process. It combines high logic density, substantial embedded memory, and a wide I/O complement in a 1152-FCBGA (35 × 35 mm) surface-mount package.
This device is positioned for mid-range, performance-sensitive applications across markets such as wireless, wireline, broadcast, computing and storage, medical, and defense where programmable logic, on-chip memory, and flexible I/O are required under industrial temperature conditions.
Key Features
- Logic Capacity 660,000 logic elements provide the resources needed for complex digital designs and high-integration system functions.
- Embedded Memory 49,610,752 total RAM bits enable large on-chip buffering, FSM state storage, and data-path memory for packet, image, or signal processing.
- I/O Density 396 user I/O pins support broad connectivity to external devices, memory, and high-speed lanes.
- Process and Architecture 20 nm Arria 10 GX architecture offers a balance of performance and power efficiency for mid-range FPGA applications.
- Power Supply Specified core voltage range of 0.870 V to 0.980 V for core power domains.
- Package and Mounting 1152-FCBGA (35 × 35 mm) package, surface-mount mounting type suited for compact board designs.
- Operating Range Industrial temperature grade with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
- Standards and IP Device family documentation highlights integrated features such as PCIe Gen1/Gen2/Gen3 hard IP, clock networks and PLLs, variable-precision DSP blocks, and low-power serial transceivers (as detailed in the Arria 10 family overview).
- RoHS Compliant Meets RoHS environmental compliance requirements.
Typical Applications
- Wireless Infrastructure Channel processing and baseband functions where programmable data-paths and on-chip memory accelerate PHY and MAC implementations.
- Wireline and Telecom Line cards, muxponders, and aggregation equipment that require high logic capacity and integrated hard IP blocks for Ethernet and interconnect protocols.
- Broadcast and Professional AV Studio switching, video transport, and transcoding systems using on-chip RAM and logic to handle real-time media streams.
- Compute and Storage Acceleration Flash cache, server offload, and custom acceleration tasks that benefit from large embedded memory and dense logic for algorithmic pipelines.
- Medical and Industrial Systems Diagnostic imaging and control equipment where industrial temperature range and programmable logic enable tailored signal processing and interfacing.
Unique Advantages
- High logic density: 660,000 logic elements enable integration of complex control, DSP, and protocol layers on a single device, reducing system BOM and board-level complexity.
- Substantial on-chip memory: Nearly 50 Mbits of RAM supports large buffers and local data storage, minimizing dependency on external memory for many designs.
- Flexible connectivity: 396 I/O pins and Arria 10 family I/O/PHY features support diverse external interfaces and high-speed serial links where required.
- Industrial temperature rating: −40 °C to 100 °C operation broadens deployment options for harsh or regulated environments.
- Compact, manufacturable package: 1152-FCBGA (35 × 35 mm) surface-mount package enables dense board layouts while supporting production assembly.
- Power-scalable core: Operates across a defined core voltage window (0.870–0.980 V) to support controlled-power designs and system power management strategies.
Why Choose 10AX066K2F35I2SG?
The 10AX066K2F35I2SG delivers a balance of logic capacity, embedded memory, and I/O flexibility in a 20 nm Arria 10 GX device, making it suited to mid-range applications that require programmable performance and on-chip integration. Its industrial temperature rating and RoHS compliance make it appropriate for a broad set of deployments where environmental range and regulatory compliance are considerations.
As part of the Arria 10 family, this device aligns with documented IP and system features such as DSP blocks, PLLs, PCIe hard IP, and low-power serial transceivers, allowing engineering teams to leverage device capabilities while scaling designs across the Arria 10 portfolio.
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