10AX066K2F35I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 96 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K2F35I2SGES – Arria 10 GX FPGA, 660000 logic elements, 396 I/O, 1152-FCBGA
The 10AX066K2F35I2SGES is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1152‑FBGA package, built on the Arria 10 device family architecture. It provides a high-density, power-aware 20 nm FPGA core with abundant on-chip RAM and flexible I/O for midrange, performance-sensitive applications.
This device is suited for markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where a combination of performance, integration and industrial temperature operation is required.
Key Features
- Core Logic – 660,000 logic elements provide high gate density for complex processing and control functions.
- Embedded Memory – 49,610,752 total RAM bits for on-chip buffering, packet staging, and data-path implementation.
- I/O and Interfaces – 396 I/Os to support diverse external interfaces and multi-channel connectivity requirements.
- Package and Mounting – 1152‑FCBGA (35 × 35 mm) supplier package in a surface-mount ball grid array for compact, high-density board designs.
- Voltage and Power – Supported core voltage range from 870 mV to 980 mV aligned with Arria 10 device power domains and efficiency features.
- Thermal and Grade – Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Family-Level Capabilities – Arria 10 device family features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLLs, PCIe Gen1/Gen2/Gen3 hard IP, and low-power serial transceivers are part of the Arria 10 architecture.
- Standards and Compliance – RoHS compliant.
Typical Applications
- Wireless infrastructure – Implements channel processing and backhaul functions using dense logic and on-chip RAM for real-time packet and signal handling.
- Wireline and networking – Supports line cards, muxponders and aggregation systems where high I/O count and PCIe/serial interfaces are required.
- Broadcast and video – Enables video switching, encoding/decoding assist, and transport functions leveraging large embedded RAM and DSP resources.
- Computing and storage – Acts as an accelerator or cache controller in cloud and server systems using extensive logic and memory resources.
- Medical and defense electronics – Suitable for imaging, radar, and secure communications systems that require industrial temperature operation and high integration.
Unique Advantages
- High-density programmable logic: 660,000 logic elements deliver capacity to implement large-scale state machines, packet processors, and custom datapaths without external glue logic.
- Substantial on-chip RAM: Nearly 50 Mbit of embedded RAM reduces dependence on external memory for buffering and low-latency data operations.
- Extensive I/O capability: 396 I/Os provide flexibility for complex multi-protocol front-ends and simultaneous interfaces.
- Industrial temperature rating: −40 °C to 100 °C supports deployment in outdoor equipment, telecom shelters, and other temperature-challenging environments.
- Compact, high-density package: 1152‑FCBGA (35 × 35 mm) lets you maximize I/O and routing density while maintaining a small board footprint.
- Arria 10 family integration: Family-level features such as DSP blocks, PLLs, embedded memory types, and PCIe hard IP provide building blocks for advanced signal-processing and networking designs.
Why Choose 10AX066K2F35I2SGES?
The 10AX066K2F35I2SGES positions itself as a high-capacity, industrial-grade Arria 10 GX FPGA option for designs that require significant logic resources, large on-chip memory, and a high I/O count in a compact FCBGA footprint. Its operating voltage and temperature range, combined with the Arria 10 family features, make it suitable for midrange, performance- and power-conscious applications across communications, broadcast, storage acceleration, medical imaging and defense systems.
Choosing this device gives designers access to the Arria 10 architecture's integration of adaptive logic, DSP capabilities and hardened interface IP, supporting scalable development and long-term deployment in demanding environments.
Request a quote or submit a pricing and availability inquiry to receive lead-time and volume-pricing information for the 10AX066K2F35I2SGES FPGA.

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