10AX066K4F35I4SGES

The 10AX066K4F35I4SGES is an Intel Arria 10 GX family Field Programmable Gate Array (FPGA) delivered as a 1152-FCBGA surface-mount device. It is built on a 20 nm FPGA architecture intended for mid-range applications that require a balance of performance and power efficiency.

This device suits a range of markets including wireless, wireline, broadcast, computing and storage, and medical/military applications where a high logic capacity, large embedded RAM and broad I/O count are required.

Key Features

• Logic Capacity  Provides 660,000 logic elements for building large, complex programmable designs.
• Embedded Memory  Includes 49,610,752 total RAM bits to support on-chip buffering, packet processing, and algorithm acceleration.
• I/O Count  396 user I/O pins to interface with external devices and memory subsystems.
• Package & Mounting  1152-FCBGA (35×35) package in a 1152-BBGA FCBGA form factor; surface-mount for standard PCB assembly.
• Power Supply  Core voltage supply range specified from 870 mV to 930 mV for device operation.
• Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards & Compliance  RoHS-compliant construction for regulatory and manufacturing needs.
• Arria 10 Family Characteristics  Part of the Arria 10 device family, which targets high-performance, power-efficient 20 nm mid-range FPGA applications.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment benefit from the device’s logic density and embedded memory.
• Wireline Networking  40G/100G muxponders, transponders and line cards can leverage the device for packet processing and protocol bridging tasks.
• Broadcast Systems  Studio switches and professional audio/video transport use the FPGA for signal routing and real-time processing functions.
• Computing & Storage  Server acceleration, flash cache and cloud infrastructure projects can use the on-chip logic and RAM for acceleration and buffering.
• Medical & Defense  Diagnostic imaging, radar, and guidance/control systems can utilize the device’s capacity and industrial temperature rating for demanding environments.

Unique Advantages

• High logic density: 660,000 logic elements enable complex system functions to be integrated on a single device, reducing part count.
• Large on-chip memory: Nearly 50 million RAM bits support large buffers and data-path acceleration without immediate reliance on external memory.
• Substantial I/O availability: 396 I/O pins provide flexibility for multi-channel interfaces and parallel data paths.
• Industrial temperature rating: −40 °C to 100 °C operation enables deployment in temperature-challenging installations.
• Compact, high-pin-count package: 1152-FCBGA (35×35) packaging delivers high integration density in a surface-mount form factor suitable for modern PCB designs.
• Low-voltage core operation: Defined core supply range (870–930 mV) supports predictable power design and thermal planning.

Why Choose 10AX066K4F35I4SGES?

The 10AX066K4F35I4SGES positions itself where significant programmable logic, large embedded RAM and broad I/O are required in an industrial temperature-rated FPGA. As an Arria 10 GX family device, it targets mid-range applications that need a balance of performance and power efficiency on a 20 nm architecture.

This device is suitable for teams designing network, broadcast, compute acceleration, medical imaging or defense systems that require scalable logic resources, on-chip memory, and a compact high-pin-count package backed by RoHS-compliant manufacturing.

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