10AX066K4F35I3SG

IC FPGA 396 I/O 1152FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA

Quantity 807 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O396Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K4F35I3SG – Arria 10 GX FPGA, 1152-FCBGA (35×35)

The 10AX066K4F35I3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC designed for mid-range, high-performance and power-sensitive applications. It is part of the Intel Arria 10 device family of 20 nm FPGAs and SoCs, delivering a combination of logic density, embedded memory, and I/O flexibility.

With 660,000 logic elements, 49,610,752 total RAM bits and 396 I/O pins in a 1152‑FCBGA (35×35) package, this industrial-grade device is specified for operation from −40 °C to 100 °C and a core supply range of 870 mV to 930 mV, making it suitable for demanding embedded and communications systems.

Key Features

  • Core & logic elements  660,000 logic elements provide substantial programmable fabric for mid-range to complex logic implementations.
  • Embedded memory  49,610,752 total RAM bits of on-chip memory and support for multiple embedded memory block configurations.
  • I/O and interfaces  396 I/O pins enable broad external connectivity; Arria 10 device documentation highlights support for high-speed interfaces including PCIe Gen1/2/3 hard IP and enhanced PCS for Interlaken and 10 Gbps Ethernet.
  • Transceivers and clocking  Device family features include low-power serial transceivers and flexible clock networks with fractional synthesis and I/O PLLs for precise timing and high-speed serial links.
  • Power characteristics  Core voltage supply specified from 870 mV to 930 mV and device-level power-saving technologies are part of the Arria 10 family design focus on power efficiency.
  • Package & mounting  1152‑FCBGA (35×35) package in a surface-mount form factor for high pin-count board integration.
  • Operating conditions  Industrial-grade temperature range from −40 °C to 100 °C for deployment in thermally demanding environments.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic density and embedded memory for signal processing.
  • Wireline communications  Line cards, muxponders and transponders where high-speed interfaces and on-chip memory support packet processing and protocol offload.
  • Broadcast and professional AV  Studio switches and video transport solutions that benefit from flexible I/O, substantial logic resources, and embedded memory for media processing.
  • Computing and storage  Server acceleration, flash cache and cloud computing applications that leverage the device’s logic density and I/O capability for hardware acceleration and data path processing.
  • Medical and defense systems  Diagnostic imaging, radar and secure communications systems that require robust operating temperature range and programmable logic for custom processing pipelines.

Unique Advantages

  • High logic density: 660,000 logic elements provide the capacity to implement complex algorithms and multi-function systems on a single device, reducing board-level component count.
  • Large on-chip memory: Nearly 50 million RAM bits of embedded memory support buffering, lookup tables and data-intensive processing without external memory in some designs.
  • Broad I/O and interface support: 396 I/Os and Arria 10 family hard IP options for PCIe and high-speed Ethernet enable integration of standard protocols and high-bandwidth links.
  • Industrial operating range: Specified −40 °C to 100 °C operation and surface-mount 1152‑FCBGA packaging support deployment in industrial and thermally challenging applications.
  • Power-aware architecture: Family-level emphasis on power-saving technologies and a defined core voltage range (870 mV–930 mV) allow designers to target energy-sensitive systems.
  • Proven Intel device family: Part of the Intel Arria 10 series, with device documentation and design resources available for development and qualification.

Why Choose 10AX066K4F35I3SG?

The 10AX066K4F35I3SG Arria 10 GX FPGA balances large programmable logic capacity, extensive embedded memory and versatile I/O in a single industrial-grade package. Its specification for industrial temperatures and defined core voltage range makes it suitable for mid-range applications that demand both performance and reliability.

Engineers designing communications, broadcast, compute-acceleration or medical/defense systems can leverage this device’s combination of logic elements, on-chip RAM and interface support to consolidate functions, simplify board design and accelerate time to market while working within a documented Intel Arria 10 device ecosystem.

Request a quote or submit an inquiry for pricing and availability of the 10AX066K4F35I3SG Arria 10 GX FPGA to begin your design evaluation.

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