10AX066K4F35I3SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 719 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K4F35I3SGES – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 660,000 logic elements, 1152‑FCBGA
The 10AX066K4F35I3SGES is an Intel Arria 10 GX family Field Programmable Gate Array (FPGA) in a 1152‑FCBGA (35×35) surface‑mount package. It delivers a high logic capacity and substantial on‑chip RAM to address performance‑sensitive, midrange FPGA applications.
Designed for use in high‑performance, power‑sensitive systems, this industrial‑grade device targets markets such as wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense electronics where logic density, memory capacity, and flexible I/O are required.
Key Features
- Core Logic 660,000 logic elements provide large combinational and sequential resource capacity for complex FPGA implementations.
- Embedded Memory 49,610,752 total RAM bits for large on‑chip buffering, lookup tables, and memory‑intensive algorithms.
- I/O Capacity 396 general purpose I/O pins to support multiple parallel interfaces and high connectivity requirements.
- Package & Mounting 1152‑FCBGA (35×35) supplier device package in a surface‑mount form factor for high‑pin‑count, compact board designs.
- Power Core voltage supply range 870 mV to 930 mV, enabling designs targeting power‑efficient operation.
- Temperature & Grade Industrial grade device rated for operation from −40°C to 100°C for robust deployment in demanding environments.
- Arria 10 Family Capabilities Series features include 20 nm midrange FPGA/SoC architecture, variable‑precision DSP blocks, embedded memory blocks, clock networks and PLLs, PCIe Gen1/2/3 hard IP, 10 Gbps Ethernet support, low‑power serial transceivers, SoC hard processor system options, dynamic and partial reconfiguration, SEU detection and correction, and comprehensive power management.
Typical Applications
- Wireless Infrastructure Channel and switch cards, and mobile backhaul equipment where dense logic and low power per function are required.
- Wireline Networking 40G/100G muxponders, transponders, and line cards that need high logic capacity and robust I/O for high‑speed data paths.
- Broadcast and Media Studio switches and professional audio/video transport systems that benefit from large on‑chip memory and flexible interfaces.
- Computing and Storage Server acceleration, flash cache and cloud compute offload solutions leveraging large logic and memory resources.
- Medical and Defense Electronics Diagnostic imaging, radar, and electronic warfare applications that require industrial temperature range and high integration.
Unique Advantages
- High Logic Density: 660,000 logic elements allow consolidation of complex functions into a single FPGA, reducing board-level component count.
- Substantial On‑Chip Memory: Nearly 50 million RAM bits support large frame buffers, packet queues, and algorithmic data storage without external memory.
- Extensive I/O: 396 I/Os enable multi‑lane interfaces and broad peripheral connectivity without multiplexing compromises.
- Industrial Reliability: −40°C to 100°C operating range and industrial grade classification support deployment in harsh and long‑life systems.
- Compact, High‑Pin Package: 1152‑FCBGA (35×35) delivers high pin count in a compact footprint for dense boards and high channel counts.
- Power‑Aware Supply Range: 870–930 mV core supply supports designs focused on power efficiency while leveraging Arria 10 family power management features.
Why Choose 10AX066K4F35I3SGES?
The 10AX066K4F35I3SGES positions itself as a high‑capacity Arria 10 GX FPGA option for midrange, performance‑sensitive designs that require a combination of large logic resources, significant on‑chip memory, and extensive I/O. Its industrial temperature rating and compact 1152‑FCBGA package make it suitable for deployed systems where space and reliability matter.
Backed by the Arria 10 device family documentation and architecture, this device is appropriate for engineers and procurement teams seeking a scalable, well‑documented FPGA platform for communications, compute acceleration, broadcast, medical, and defense applications.
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