10AX066K4F35E3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 429 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K4F35E3LG – Arria 10 GX FPGA, 660000 logic elements, 1152‑FCBGA
The 10AX066K4F35E3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1152‑FCBGA package. It is a 20 nm mid‑range FPGA family device built for high‑performance, power‑efficient designs across communications, broadcast, computing, medical, and defense markets.
With 660,000 logic elements and 49,610,752 total RAM bits, this surface‑mount, extended‑grade FPGA provides a balance of compute capacity, on‑chip memory and I/O density for midrange, power‑sensitive applications.
Key Features
- Logic Capacity — 660,000 logic elements to implement large combinational and sequential logic designs.
- Embedded Memory — 49,610,752 total RAM bits for on‑chip buffering, packet processing, and scratchpad storage.
- I/O Density — 396 I/O pins to support wide parallel interfaces and high‑pin‑count system connectivity.
- Package & Mounting — 1152‑BBGA / 1152‑FCBGA (supplier device package: 1152‑FCBGA (35×35)) in a surface‑mount form factor for compact board integration.
- Power Supply — Core voltage range of 870 mV to 930 mV to match platform power rails and enable predictable power budgeting.
- Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for use in controlled industrial and telecom environments.
- RoHS Compliant — Meets RoHS environmental requirements for lead‑free manufacturing.
- Arria 10 Series Capabilities — Series documentation highlights features such as embedded DSP blocks, advanced clock networks and PLLs, configurable memory blocks, high‑speed serial transceivers and hard IP (e.g., PCIe), dynamic and partial reconfiguration, and SEU detection/correction mechanisms.
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems leveraging on‑chip DSP and I/O density.
- Wireline Networking — 40G/100G muxponder and transponder line cards and 100G line card designs requiring high logic and memory capacity.
- Broadcast & Media — Studio switches, video conferencing and professional audio/video processing where real‑time data handling and flexible I/O are essential.
- Computing & Storage — Flash cache, cloud server acceleration, and storage front‑end functions that benefit from embedded memory and programmable logic.
- Medical & Defense Systems — Diagnostic imaging, radar, and electronic warfare applications that require configurable processing and the Arria 10 family’s performance characteristics.
Unique Advantages
- High Logic Density: 660,000 logic elements enable integration of complex algorithms and system functions into a single FPGA, reducing external component count.
- Substantial On‑Chip Memory: Nearly 50 Mbit of embedded RAM supports large buffers, lookup tables, and in‑FPGA data structures for lower latency system designs.
- Broad I/O Connectivity: 396 I/O pins provide flexible interfacing to parallel buses, memory interfaces, and peripheral logic without excessive external glue logic.
- Compact, Board‑Ready Package: 1152‑FCBGA (35×35) surface‑mount package simplifies PCB layout for high‑density applications while preserving thermal and signal routing characteristics.
- Power and Temperature Certainty: Defined core voltage (870–930 mV) and 0 °C to 100 °C operating range allow predictable design choices for power delivery and thermal management.
- Series Feature Set: Benefits from Arria 10 family capabilities such as low‑power transceivers, DSP resources, clocking options, and hard IP support for accelerated development.
Why Choose 10AX066K4F35E3LG?
The 10AX066K4F35E3LG Arria 10 GX FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 1152‑FCBGA package. It is positioned for midrange designs that require substantial programmable logic and on‑chip RAM while operating within defined voltage and temperature envelopes.
Designers targeting communications, compute acceleration, broadcast, medical imaging or defense applications will find the Arria 10 GX part suitable for integrating complex functions and high‑bandwidth interfaces. As part of the Intel Arria 10 family, it aligns with the series’ documented features for power efficiency, reconfiguration capability, and system‑level integration.
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