10AX066K3F40E2LG

IC FPGA 696 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 49610752 660000 1517-BBGA, FCBGA

Quantity 612 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K3F40E2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX066K3F40E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1517-FCBGA package. It is a 20 nm mid-range FPGA family member designed for high-performance, power-efficient midrange applications across communications, broadcast, computing, medical, and defense markets.

With a large logic fabric, abundant embedded RAM and a high I/O count, this device targets demanding designs that require integration of DSP, memory and high-speed interfaces while operating within an extended temperature range.

Key Features

  • Core Logic  660,000 logic elements provide substantial programmable logic capacity for complex FPGA designs and system integration.
  • Embedded Memory  49,610,752 total RAM bits enable large on-chip buffering and state storage for data-paths and packet processing.
  • I/O Density  696 I/O pins support extensive external interfaces and high pin-count system connectivity.
  • Advanced Transceiver & Interfaces  Family-level features include low-power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP, and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet (as documented for Arria 10 GX devices).
  • DSP and Processing  Variable-precision DSP blocks and support for SoC integration are part of the device family, enabling signal processing and hardware acceleration tasks.
  • Clocking and Reconfiguration  Integrated clock networks, PLL clock sources, and support for dynamic and partial reconfiguration provide flexible clocking and on-the-fly design updates.
  • Power and Voltage  Core voltage supply range is 870 mV to 930 mV, supporting the device’s low-voltage operation characteristics.
  • Package & Thermal  Supplier device package: 1517-FCBGA (40×40) surface-mount package; operating temperature range 0 °C to 100 °C; Grade: Extended.
  • Reliability & Safety Features  Family-level features include SEU error detection and correction and configuration management capabilities for reliable operation in mission-critical systems.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment benefiting from high logic capacity and on-chip memory for real-time signal processing.
  • High-Speed Wireline Networking  Line cards, muxponders and transponders (40G/100G) that leverage the device family’s transceivers and PCIe hard IP for high-bandwidth transport and aggregation.
  • Video and Broadcast Systems  Studio switches, videoconferencing and professional audio/video processing which require dense I/O and substantial embedded RAM for frame buffering and processing pipelines.
  • Compute Acceleration and Storage  Server acceleration and flash cache applications using the device’s DSP blocks, large RAM and high logic element count to offload compute-bound tasks.
  • Medical and Defense Systems  Diagnostic imaging, radar and electronic warfare subsystems that need configurable logic, on-chip memory and reliability features.

Unique Advantages

  • Substantial Logic Capacity: 660,000 logic elements allow implementation of large, complex designs and multiple functions on a single device, reducing board-level complexity.
  • Large On-Chip Memory: Nearly 49.6 Mb of embedded RAM supports deep buffers, lookup tables and state machines without extensive external memory.
  • High I/O Count: 696 I/O pins facilitate dense external connectivity for multi-channel systems and parallel interfaces.
  • High-Speed Interface Support: Arria 10 GX family-level support for serial transceivers and PCIe hard IP simplifies integration of high-bandwidth links and networking protocols.
  • Extended Temperature Grade: Rated 0 °C to 100 °C, suitable for many commercial and industrially oriented environments where extended operating ranges are required.
  • Compact, Surface-Mount Package: 1517-FCBGA (40×40) package offers a high-density footprint for space-constrained boards while maintaining thermal and signal integrity.

Why Choose 10AX066K3F40E2LG?

The 10AX066K3F40E2LG Arria 10 GX FPGA combines a large programmable fabric, extensive on-chip memory and a high I/O count in a compact FCBGA package. It is positioned for midrange, power-sensitive designs that require integration of DSP functions, high-speed interfaces and reliable configuration management.

Engineering teams targeting communications, broadcast, compute acceleration, medical imaging or defense subsystems will find the device’s mix of logic capacity, embedded RAM and family-level transceiver and IP support beneficial for reducing system BOM, consolidating functions and accelerating time-to-market.

Request a quote or submit an inquiry today to evaluate 10AX066K3F40E2LG for your next FPGA-based design.

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