10AX066K3F35I2SGES

The 10AX066K3F35I2SGES is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑ball FCBGA package. It is a 20‑nm mid‑range FPGA family device designed for performance and power efficiency across data‑plane, compute and signal processing applications.

Built for markets including wireless, wireline, broadcast, computing and storage, medical and military, this device targets systems that require high logic density, substantial on‑chip RAM and a broad set of I/O and transceiver features.

Key Features

• Logic Capacity — 660,000 logic elements to implement complex digital logic and control functions.
• On‑chip Memory — 49,610,752 total RAM bits for buffering, packet processing and large data structures inside the FPGA fabric.
• I/O — 396 device I/O pins to support diverse external interfaces and parallel connectivity.
• Advanced Fabric Blocks — Includes adaptive logic modules, variable‑precision DSP blocks and embedded memory blocks as described in the Arria 10 device family documentation.
• High‑speed Serial and Hard IP — Low‑power serial transceivers, PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for high‑speed protocols are part of the device family feature set.
• Power and Clocking — Device family implements power‑saving technologies and a comprehensive clock network with PLL clock sources and fractional synthesis as documented for Arria 10 devices.
• Package and Mounting — 1152‑FCBGA (35×35 mm) supplier package, surface‑mount mounting for board‑level integration.
• Supply and Temperature — Core supply range 870 mV to 930 mV; industrial operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS‑compliant.

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems where logic density and on‑chip memory support signal processing and protocol tasks.
• Wireline Networking — 40G/100G muxponders, transponders and line cards benefiting from integrated hard IP for serial protocols and large buffering capacity.
• Broadcast and Professional AV — Studio switches, transport and videoconferencing hardware that require flexible I/O and on‑device processing resources.
• Computing and Storage Acceleration — Flash cache, cloud server acceleration and compute offload roles that use the device’s DSP resources and memory for data‑plane processing.
• Medical and Defense Systems — Diagnostic imaging, radar and secure communications where industrial temperature range and high logic/memory capacity are required.

Unique Advantages

• High Logic Density: 660,000 logic elements provide the capacity to implement large, complex designs on a single device.
• Substantial On‑Chip RAM: Nearly 50 million bits of embedded RAM reduce external memory dependence and accelerate data buffering and stateful processing.
• Wide I/O and Package Integration: 396 I/O pins and a 1152‑ball FCBGA package enable rich system interfacing while supporting compact, surface‑mount board designs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to support demanding environments and extended operating conditions.
• Integrated High‑Speed Interfaces: Low‑power serial transceivers and documented hard IP for PCIe and Ethernet protocols simplify high‑bandwidth system designs.
• Power‑aware Architecture: Part of the Arria 10 family that incorporates power‑saving technologies to help manage system energy consumption.

Why Choose 10AX066K3F35I2SGES?

The 10AX066K3F35I2SGES Arria 10 GX FPGA balances high logic and memory capacity with industrial operating range and a compact 1152‑FCBGA footprint. It is positioned for mid‑range systems that need substantial on‑device resources for signal processing, protocol acceleration and adaptable I/O interfacing.

Designed within the Intel Arria 10 device family, this FPGA aligns with documented device features such as advanced DSP blocks, embedded memory configurations, clocking options and transceiver capabilities—offering a scalable platform for engineering teams focused on performance, integration and long‑term product viability.

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