10AX066K3F35E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 336 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K3F35E2SG – Arria 10 GX FPGA, 660,000 logic elements, 1152‑FCBGA
The 10AX066K3F35E2SG is an Intel Arria 10 GX field‑programmable gate array (FPGA) in a 1152‑FBGA (35×35) package. It is part of the Arria 10 family of 20‑nm mid‑range FPGAs designed for high‑performance, power‑sensitive applications.
With 660,000 logic elements, 49,610,752 bits of on‑chip RAM and 396 user I/Os, this device targets demanding midrange systems across wireless, wireline, broadcast, computing, medical and military markets where integration, performance and power efficiency matter.
Key Features
- Core Logic 660,000 logic elements provide extensive programmable fabric for complex digital designs and algorithm acceleration.
- Embedded Memory 49,610,752 total RAM bits for large on‑chip buffering, lookup tables and state storage.
- I/O and Package 396 I/Os in a 1152‑FCBGA (35×35) surface‑mount package enable high‑density board integration and signal routing.
- Power and Voltage Core supply range of 870 mV to 930 mV; device architecture emphasizes power efficiency across midrange applications.
- Thermal and Grade Extended grade device rated for 0 °C to 100 °C operating temperature to suit a range of commercial and extended‑temperature environments.
- Integrated System Features Family capabilities include variable‑precision DSP blocks, embedded memory blocks, fractional and I/O PLLs, PCIe hard IP and low‑power serial transceivers to accelerate common system functions.
- Surface Mount Mounting 1152‑FCBGA surface‑mount package for compact, manufacturable board designs.
Typical Applications
- Wireless Infrastructure Channel and switch cards or mobile backhaul equipment leveraging programmable logic density and on‑chip memory for signal processing and buffering.
- Wireline Networking Line cards, muxponders and transponders where large logic capacity and transceiver/hard IP support enable high‑speed data aggregation and protocol handling.
- Broadcast & Professional AV Studio switches and videoconferencing equipment that benefit from programmable I/O, on‑chip memory and DSP resources for video and audio processing.
- Computing & Storage Flash cache controllers, server acceleration and cloud infrastructure components using abundant logic and embedded RAM for acceleration tasks.
- Medical & Defense Systems Diagnostic imaging, radar and electronic warfare applications that require configurable compute, high I/O count and extended temperature operation.
Unique Advantages
- High programmable capacity: 660,000 logic elements enable implementation of complex algorithms and multi‑function systems on a single device, reducing board-level component count.
- Large on‑chip RAM: Nearly 50 Mbits of embedded RAM supports deep buffering, packet queues and data‑intensive processing without external memory for many tasks.
- Rich system IP: Family features such as DSP blocks, PLLs, PCIe hard IP and serial transceivers accelerate common functions and shorten development time.
- Compact, manufacturable package: 1152‑FCBGA (35×35) surface‑mount package gives high I/O density in a compact footprint for space‑constrained designs.
- Power‑aware architecture: Built on the Arria 10 family’s power‑efficiency improvements, the device supports energy‑sensitive applications while delivering midrange performance.
- Extended operating range: Extended grade and 0 °C to 100 °C rating provide predictable operation across a wide set of commercial and extended environments.
Why Choose 10AX066K3F35E2SG?
The 10AX066K3F35E2SG positions itself as a high‑capacity, midrange FPGA that balances programmable logic, substantial on‑chip memory and comprehensive system IP within a compact 1152‑FCBGA package. It is suited for designers who need significant logic and memory resources combined with high I/O density and the Arria 10 family’s power‑aware architecture.
Backed by the Arria 10 device documentation and design resources, this device supports development flows that scale across similar family devices, helping teams reuse IP, manage power and accelerate time to market for communications, compute, broadcast and embedded systems.
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