10AX066K3F35I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 396 49610752 660000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 853 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 396 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K3F35I2SG – Arria 10 GX FPGA, 660,000 Logic Elements, 1152-FCBGA (35×35)
The 10AX066K3F35I2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152-FCBGA (35×35) package. It provides high logic capacity, substantial on‑chip RAM, and a large I/O complement for mid-range, performance-sensitive applications.
Designed for markets such as wireless infrastructure, wireline networking, broadcast, computing and storage, medical imaging, and defense, the device pairs high logic and memory resources with power-aware architecture and a broad set of connectivity and system features described in the Arria 10 device documentation.
Key Features
- Logic Capacity – 660,000 logic elements to support complex digital designs and high-density integration.
- Embedded Memory – 49,610,752 total RAM bits of on‑chip memory for large buffering, caches, and local data storage.
- I/O and Package – 396 user I/Os in a 1152-FCBGA (35×35) surface-mount package to accommodate high pin-count system interfaces.
- Voltage and Power – Core supply range specified at 870 mV to 930 mV, enabling defined power and timing design margins.
- Temperature and Grade – Industrial grade operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
- High-speed Interfaces and IP – Datasheet indicates support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers for high-bandwidth links.
- DSP and Processing Resources – Device documentation references variable-precision DSP blocks for signal processing tasks and options for SoC integration with a hard processor system.
- Clocking and Reconfiguration – Comprehensive clock networks with PLL clock sources plus support for dynamic and partial reconfiguration as described in the Arria 10 device overview.
Typical Applications
- Wireless Infrastructure – Channel and switch cards for remote radio heads and mobile backhaul, leveraging high logic density and high-speed serial links.
- Wireline & Networking – 40G/100G muxponders, transponders and 100G line cards for aggregation and bridging applications using the device's high-speed IP and transceivers.
- Broadcast & Professional AV – Studio switches, servers, and transport systems where on‑chip memory and reconfigurability simplify media buffering and routing.
- Computing & Storage – Flash cache, cloud server acceleration, and server offload functions that benefit from large on‑chip RAM and dense logic resources.
Unique Advantages
- High logic density: 660,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level integration steps.
- Extensive on‑chip memory: Nearly 50 million RAM bits help minimize external memory dependence and improve system latency for buffering and caching.
- Industrial temperature capability: Rated from -40 °C to 100 °C to meet the demands of industrial and ruggedized deployments.
- Comprehensive connectivity: Built-in IP and transceiver support for PCIe, Interlaken, and 10 Gbps Ethernet provides flexible paths for high-bandwidth system interfaces.
- Compact, high-pin-count package: 1152-FCBGA (35×35) with 396 I/Os balances board space with I/O density for complex designs.
- Configurable system features: Clocking resources and support for dynamic/partial reconfiguration allow designers to optimize performance and update functionality in-field.
Why Choose 10AX066K3F35I2SG?
The 10AX066K3F35I2SG positions itself as a high-capacity Arria 10 GX FPGA for mid-range, performance- and power-sensitive designs. Its combination of 660,000 logic elements, nearly 50 Mbits of on‑chip RAM, abundant I/O, and documented high-speed IP makes it suitable for system-level integration where density, connectivity, and industrial temperature operation matter.
Supported by the Arria 10 device family documentation, the device offers architects predictable supply and thermal parameters, reconfiguration capabilities, and connectivity options that simplify platform development and long-term design maintenance.
Request a quote or submit an inquiry to our sales team for pricing, availability, and technical support for the 10AX066K3F35I2SG.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018