10AX066K3F35E2LG

The 10AX066K3F35E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1152‑FCBGA (35×35) package. It is a 20 nm mid‑range FPGA family member designed for performance and power‑sensitive applications, offering a large logic capacity and substantial on‑chip memory.

This device targets applications across wireless infrastructure, wireline networking, broadcast and pro AV, computing and storage, medical imaging, and defense markets where high logic density, ample memory, and flexible I/O are required.

Key Features

• Logic Capacity  660,000 logic elements to support complex digital designs and custom hardware acceleration.
• Embedded Memory  49,610,752 total on‑chip RAM bits for large buffering, frame storage, and memory‑centric algorithms.
• I/O Density  396 user I/Os to interface with high‑density front‑end, memory, and peripheral systems.
• Package & Mounting  1152‑FCBGA (35×35) package; surface‑mount device suitable for compact, high‑pin‑count board designs.
• Power Supply  Core voltage range 870 mV to 930 mV for the device core power domain.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for system‑level thermal designs.
• Regulatory  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel processing and backhaul systems that benefit from high logic density and efficient on‑chip memory.
• Wireline & Networking  Line cards, muxponders, and packet processing where dense I/O and programmable logic enable protocol offload and aggregation.
• Broadcast & Pro AV  Video switching, processing, and transport applications that require large frame buffers and flexible I/O interfacing.
• Computing & Storage  Server acceleration and cache/flash buffering solutions that leverage on‑chip RAM and customizable logic blocks.

Unique Advantages

• High logic density: 660,000 logic elements enable implementation of complex algorithms and parallel processing pipelines on a single device.
• Substantial on‑chip memory: Nearly 50 million RAM bits reduce external memory dependence and improve latency for buffering and working datasets.
• Robust I/O complement: 396 I/Os provide the flexibility to connect multiple interfaces and memory channels without external expanders.
• Compact, high‑pin package: 1152‑FCBGA (35×35) offers a high pin count in a compact footprint for dense board layouts.
• Power‑aware core voltage: 870–930 mV core supply supports designs that require controlled core power domains.
• Extended operating range: 0 °C to 100 °C grade suits applications with elevated board temperatures and year‑round operation.

Why Choose 10AX066K3F35E2LG?

The 10AX066K3F35E2LG balances high logic capacity, significant embedded memory, and substantial I/O in a single 1152‑FCBGA package, making it well suited for mid‑range systems that demand programmable performance and power efficiency. Its specification set supports developers building compute‑intensive, memory‑heavy, or I/O‑dense designs where integration and scalability matter.

For engineering teams and procurement choosing this Arria 10 GX device, the mix of logic resources, on‑chip RAM, and package density delivers a platform that scales from prototyping to volume designs while aligning with RoHS compliance and extended temperature operation.

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