10AX066K3F40I2LG

The 10AX066K3F40I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs and SoCs designed for applications that require a balance of performance and power efficiency.

Targeted at communications, compute and industrial systems, this device provides large programmable logic capacity, substantial embedded memory, and a high I/O count for complex system integration and high-density interfacing.

Key Features

• Logic Capacity — 660,000 logic elements provide significant programmable fabric for complex digital logic, control, and custom accelerators.
• Embedded Memory — 49,610,752 total RAM bits enable large on-chip buffering, LUT-based storage and embedded memory structures for data-intensive designs.
• I/O Density — 696 user I/O pins allow extensive external device connectivity and high-pin-count system interfaces.
• Package & Mounting — 1517-BBGA / 1517-FCBGA (40×40) ball-grid package, surface-mountable for PCB integration in space-constrained designs.
• Power Supply — Core voltage range 870 mV to 930 mV for proper power planning and supply design.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and regulatory compliance in applicable markets.

Typical Applications

• Wireless Infrastructure — Channel processing and remote radio head modules that require programmable logic for protocol handling and signal routing.
• High-Speed Wireline — Line cards, muxponders and transponders in 40G/100G systems where large logic arrays and high I/O counts support packet processing and protocol conversion.
• Broadcast & Professional AV — Studio switching and video transport systems that need on-board buffering and deterministic real-time logic.
• Compute & Storage Acceleration — Server offload, cache management and custom acceleration functions that leverage embedded memory and dense logic resources.
• Industrial & Medical Systems — Control, data acquisition and imaging subsystems operating across a wide temperature range and requiring industrial-grade components.

Unique Advantages

• High Logic Density: 660,000 logic elements deliver the programmable capacity to implement large-scale state machines, datapaths and custom accelerators on a single device.
• Substantial On‑Chip Memory: Nearly 50 million RAM bits reduce dependency on external memory for buffering and accelerate dataflow inside the FPGA fabric.
• Extensive I/O Resources: 696 I/O pins enable direct interfacing to numerous peripherals, multi-lane transceivers, or parallel buses without extensive external glue logic.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in temperature-challenged industrial and field environments.
• Compact BGA Package: 1517-FCBGA (40×40) provides a high-pin-count, surface-mount solution for dense PCB designs where board area is at a premium.
• Regulatory Compliance: RoHS compliance facilitates integration into lead-free product builds and simplifies supply-chain compliance.

Why Choose 10AX066K3F40I2LG?

The 10AX066K3F40I2LG Arria 10 GX FPGA combines large programmable logic capacity, substantial embedded RAM, and high I/O density in a compact FCBGA package targeted at mid-range, power-conscious system designs. Its industrial temperature rating and RoHS compliance make it suitable for demanding deployment scenarios where reliability and regulatory compliance matter.

Designers building communications, compute acceleration, broadcast, industrial control or imaging systems will find the device’s balance of logic, memory and I/O useful for consolidating functions on a single programmable device while maintaining predictable power and thermal considerations tied to the specified core voltage range.

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