10AX066K3F40I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 49610752 660000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 707 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 250540 | Number of Logic Elements/Cells | 660000 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49610752 |
Overview of 10AX066K3F40I2SG – Arria 10 GX FPGA, 1517-FCBGA (40×40), Industrial
The 10AX066K3F40I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) IC designed for 20 nm mid-range applications. It delivers a balance of high performance and power-efficient operation for power-sensitive, midrange designs.
Built for connectivity and compute tasks, this device targets markets such as wireless infrastructure, wireline transport, broadcast, computing and storage, medical imaging, and military systems where density, I/O count, and embedded memory are important.
Key Features
- Logic Capacity Provides 660,000 logic elements (cells) for implementing complex programmable logic and control functions.
- Embedded Memory Total on-chip RAM capacity of 49,610,752 bits to support buffering, lookup tables, and embedded data storage.
- I/O Resources High pin count with 696 I/O to support broad external interface connectivity and multi-channel systems.
- Transceivers and High-Speed Interfaces Arria 10 GX family features low-power serial transceivers and hard IP blocks for PCIe Gen1/2/3 and high-speed packet interfaces, enabling common high-throughput link protocols.
- DSP and Arithmetic Blocks Variable-precision DSP resources provide hardware acceleration options for signal processing and compute-intensive tasks.
- Clocking and Reconfiguration Advanced clock networks, PLL clock sources, and support for dynamic and partial reconfiguration allow flexible timing architectures and runtime adaptability.
- Power and Voltage Core supply range specified at 870 mV to 930 mV to match Arria 10 device power domains and system power designs.
- Package and Mounting 1517-BBGA FCBGA package (1517-FCBGA, 40×40) in a surface-mount form factor for dense PCB integration.
- Operating Range Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Standards and Compliance RoHS compliant to support environmental and regulatory requirements.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and transceivers accelerate baseband and link processing.
- Wireline transport 40G/100G muxponders, transponders, and line cards requiring high-speed interfaces and programmable packet processing.
- Broadcast and Pro AV Studio switches, transport and videoconferencing equipment that need flexible I/O and real-time processing.
- Computing and Storage Cloud server acceleration and flash cache applications leveraging on-chip DSP and memory resources for low-latency tasks.
- Medical and Defense Diagnostic imaging and radar/missile guidance applications where logic density, embedded memory, and extended temperature range are required.
Unique Advantages
- High logic density: 660,000 logic elements enable complex designs and high levels of integration on a single device.
- Substantial on-chip RAM: Nearly 50 Mbits of embedded RAM reduces external memory reliance and accelerates data buffering and algorithm implementation.
- Extensive I/O count: 696 I/O pins support multi-channel interfaces and complex board-level connectivity without immediate need for external multiplexing.
- Industrial temperature rating: −40 °C to 100 °C supports deployment in temperature-challenged environments.
- Compact, surface-mount package: 1517-FCBGA (40×40) package allows dense PCB layouts while maintaining thermal and signal integrity for high-pin-count applications.
- Tight core voltage specification: 870–930 mV core supply range supports predictable power design and integration with Arria 10 power domains.
Why Choose 10AX066K3F40I2SG?
The 10AX066K3F40I2SG positions itself as a high-density, power-conscious midrange FPGA suitable for designs that require significant logic capacity, embedded memory, and a large complement of I/O. Its Arria 10 GX feature set supports common high-speed interfaces and configurable DSP resources, making it a fit for communications, video, compute acceleration, and instrument applications.
Backed by Intel Arria 10 device documentation and design guidance, the device is a practical choice for engineering teams seeking scalability, field reconfiguration capability, and a platform that aligns with established midrange FPGA development flows.
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