10AX066K3F40I2SG

IC FPGA 696 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 696 49610752 660000 1517-BBGA, FCBGA

Quantity 707 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs250540Number of Logic Elements/Cells660000
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49610752

Overview of 10AX066K3F40I2SG – Arria 10 GX FPGA, 1517-FCBGA (40×40), Industrial

The 10AX066K3F40I2SG is an Intel Arria 10 GX field-programmable gate array (FPGA) IC designed for 20 nm mid-range applications. It delivers a balance of high performance and power-efficient operation for power-sensitive, midrange designs.

Built for connectivity and compute tasks, this device targets markets such as wireless infrastructure, wireline transport, broadcast, computing and storage, medical imaging, and military systems where density, I/O count, and embedded memory are important.

Key Features

  • Logic Capacity  Provides 660,000 logic elements (cells) for implementing complex programmable logic and control functions.
  • Embedded Memory  Total on-chip RAM capacity of 49,610,752 bits to support buffering, lookup tables, and embedded data storage.
  • I/O Resources  High pin count with 696 I/O to support broad external interface connectivity and multi-channel systems.
  • Transceivers and High-Speed Interfaces  Arria 10 GX family features low-power serial transceivers and hard IP blocks for PCIe Gen1/2/3 and high-speed packet interfaces, enabling common high-throughput link protocols.
  • DSP and Arithmetic Blocks  Variable-precision DSP resources provide hardware acceleration options for signal processing and compute-intensive tasks.
  • Clocking and Reconfiguration  Advanced clock networks, PLL clock sources, and support for dynamic and partial reconfiguration allow flexible timing architectures and runtime adaptability.
  • Power and Voltage  Core supply range specified at 870 mV to 930 mV to match Arria 10 device power domains and system power designs.
  • Package and Mounting  1517-BBGA FCBGA package (1517-FCBGA, 40×40) in a surface-mount form factor for dense PCB integration.
  • Operating Range  Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Standards and Compliance  RoHS compliant to support environmental and regulatory requirements.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and transceivers accelerate baseband and link processing.
  • Wireline transport  40G/100G muxponders, transponders, and line cards requiring high-speed interfaces and programmable packet processing.
  • Broadcast and Pro AV  Studio switches, transport and videoconferencing equipment that need flexible I/O and real-time processing.
  • Computing and Storage  Cloud server acceleration and flash cache applications leveraging on-chip DSP and memory resources for low-latency tasks.
  • Medical and Defense  Diagnostic imaging and radar/missile guidance applications where logic density, embedded memory, and extended temperature range are required.

Unique Advantages

  • High logic density: 660,000 logic elements enable complex designs and high levels of integration on a single device.
  • Substantial on-chip RAM: Nearly 50 Mbits of embedded RAM reduces external memory reliance and accelerates data buffering and algorithm implementation.
  • Extensive I/O count: 696 I/O pins support multi-channel interfaces and complex board-level connectivity without immediate need for external multiplexing.
  • Industrial temperature rating: −40 °C to 100 °C supports deployment in temperature-challenged environments.
  • Compact, surface-mount package: 1517-FCBGA (40×40) package allows dense PCB layouts while maintaining thermal and signal integrity for high-pin-count applications.
  • Tight core voltage specification: 870–930 mV core supply range supports predictable power design and integration with Arria 10 power domains.

Why Choose 10AX066K3F40I2SG?

The 10AX066K3F40I2SG positions itself as a high-density, power-conscious midrange FPGA suitable for designs that require significant logic capacity, embedded memory, and a large complement of I/O. Its Arria 10 GX feature set supports common high-speed interfaces and configurable DSP resources, making it a fit for communications, video, compute acceleration, and instrument applications.

Backed by Intel Arria 10 device documentation and design guidance, the device is a practical choice for engineering teams seeking scalability, field reconfiguration capability, and a platform that aligns with established midrange FPGA development flows.

Request a quote or submit an inquiry to obtain pricing, availability, and procurement details for 10AX066K3F40I2SG.

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