10AX090N4F45E3SG

IC FPGA 768 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 768 59234304 900000 1932-BBGA, FCBGA

Quantity 678 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O768Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs339620Number of Logic Elements/Cells900000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits59234304

Overview of 10AX090N4F45E3SG – Arria 10 GX FPGA, 900,000 logic elements, 1932-FCBGA

The 10AX090N4F45E3SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 1932-FCBGA (45 × 45 mm) package. It is a 20 nm mid-range FPGA device family member designed for high-performance, power-sensitive applications.

With 900,000 logic elements, on-chip embedded memory, high-speed transceiver capability and a broad set of system features, this device targets data communications, compute acceleration, broadcast, and other mid-range market applications that require integration of logic, memory and high-density I/O.

Key Features

  • Core Logic  900,000 logic elements provide large-scale programmable logic capacity for complex designs and system integration.
  • Embedded Memory  59,234,304 total RAM bits of on-chip memory support large buffering, caches and data-path implementations.
  • I/O Density  768 I/O pins enable high-pin-count interfaces for multi-channel systems, board-level partitioning and dense connectivity.
  • Transceivers and SerDes  Arria 10 GX devices include low-power serial transceivers and transceiver channels suitable for high-speed serial links and protocol implementations.
  • Hard IP and System Interfaces  Device family documentation lists PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP supporting protocols such as 10 Gbps Ethernet and Interlaken.
  • DSP and Clocking  Variable-precision DSP blocks and comprehensive clock networks including PLL clock sources provide flexible datapath and timing resources.
  • Package & Mounting  1932-FCBGA (45 × 45 mm) package, surface mount, suitable for high-density board layouts where thermal and routing considerations are important.
  • Power and Operating Range  Core supply range 870 mV to 930 mV supports targeted power envelopes; rated operating temperature range 0 °C to 100 °C and Extended grade classification.
  • RoHS Compliant  Device is RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and transceiver capabilities.
  • Wireline Networking  40G/100G muxponders, transponders and 100G line cards where high-speed serial links and protocol hard IP (PCIe, Ethernet, Interlaken) are required.
  • Broadcast and Media  Studio switches, video processing and transport systems that need large on-chip memory and flexible I/O for multi-channel video streams.
  • Compute and Storage  Flash cache, server acceleration and cloud infrastructure applications using dense logic and embedded memory for data-path acceleration.
  • Medical and Defense Systems  Diagnostic imaging, radar and electronic warfare systems benefiting from high logic capacity, DSP resources and extensive I/O.

Unique Advantages

  • High Logic Capacity: 900,000 logic elements enable consolidation of complex system functions into a single device, reducing board-level components.
  • Substantial On-Chip Memory: Over 59 million bits of embedded RAM provide large buffer and cache capabilities for data-intensive pipelines.
  • Extensive I/O Count: 768 I/Os support multi-lane interfaces and dense peripheral connectivity for modular system designs.
  • Integrated High-Speed Interfaces: Built-in transceivers and documented hard IP for PCIe and high-speed Ethernet simplify implementation of standard protocols.
  • Power-Efficient 20 nm Architecture: Designed as a 20 nm mid-range device family, offering a balance of performance and power that suits power-sensitive applications.
  • Extended Temperature Grade: Rated for 0 °C to 100 °C operation, providing a wider commercial temperature window for demanding deployments.

Why Choose 10AX090N4F45E3SG?

The 10AX090N4F45E3SG Arria 10 GX FPGA brings a combination of high logic density, large embedded memory and broad I/O capacity in a single 1932-FCBGA package. It is positioned for mid-range designs that require substantial programmable resources along with high-speed serial interfaces and protocol hard IP.

For engineers building communications, compute acceleration, broadcast or imaging systems, this device offers a scalable platform with feature sets documented in Intel's Arria 10 device materials. The Extended grade and RoHS compliance add practical deployment flexibility while the supply-voltage and thermal specifications support defined power and thermal design planning.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the 10AX090N4F45E3SG Arria 10 GX FPGA.

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