10AX090N4F45I3SG

The 10AX090N4F45I3SG is an Intel Arria 10 GX series FPGA device delivering a high logic capacity and extensive embedded memory in a 1932‑FCBGA package. It is built on Intel’s Arria 10 device architecture and targets mid‑range applications that require a balance of performance and power efficiency.

Typical market uses include wireless and wireline communications, broadcast and professional media, computing and storage acceleration, and mission‑critical systems where large I/O counts, significant on‑chip RAM, and industrial operating range are required.

Key Features

• Logic Capacity — 900,000 logic elements to implement large, complex digital designs.
• Embedded Memory — 59,234,304 total RAM bits for buffering, packet storage, and on‑chip data structures.
• I/O Density — 768 user I/Os to support wide peripheral, memory, and high‑speed interface connectivity.
• Package & Mounting — 1932‑FBGA (45×45) FCBGA package, surface‑mount mounting for high‑density board designs.
• Power Supply — Core supply range of 870 mV to 930 mV to match system power rails and power‑management strategies.
• Operating Temperature — Industrial temperature grade operating from −40 °C to 100 °C for deployment in demanding environments.
• Device Family — Part of the Intel Arria 10 device family, designed for mid‑range FPGA use with a focus on performance and power efficiency.

Typical Applications

• Wireless infrastructure — Channel and switch card implementations and mobile backhaul components that require large logic resources and substantial on‑chip memory.
• Wireline networking — 40G/100G muxponder, transponder and line card designs that need high I/O counts and FPGA‑level packet processing.
• Broadcast and professional media — Studio switching and transport functions where on‑chip RAM and configurable logic enable custom signal routing and processing.
• Computing and storage acceleration — Flash cache and server acceleration tasks that leverage dense logic and memory to offload compute or buffering workloads.
• Defense and medical systems — Embedded systems such as radar processing, diagnostic imaging, and guidance/control where industrial temperature range and robust packaging are required.

Unique Advantages

• High logic density: 900,000 logic elements provide headroom for large-scale FPGA implementations and complex state machines.
• Substantial on‑chip RAM: 59.2 Mbits of embedded memory reduces external memory dependence and simplifies board-level designs.
• Extensive I/O: 768 I/O pins enable wide parallel interfaces, numerous peripherals, or multi‑channel link implementations.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in harsh or temperature‑variable environments.
• Compact, manufacturable package: 1932‑FCBGA (45×45) surface‑mount package balances pin count and board area for dense system designs.
• Low‑voltage core operation: Core supply range of 870 mV–930 mV assists integration with modern power systems and power‑management schemes.

Why Choose 10AX090N4F45I3SG?

This Arria 10 GX FPGA provides a combination of high logic resources, significant embedded RAM, and a large I/O complement in an industrial‑rated FCBGA package. Its specifications make it well suited to mid‑range designs that require balanced performance, integration density, and power considerations.

Choose the 10AX090N4F45I3SG when your design demands substantial on‑chip memory, a high count of configurable logic elements, and robust operating temperature and packaging characteristics for professional, communications, and embedded applications.

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