10AX090S1F45I1SG

The 10AX090S1F45I1SG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 1932‑FBGA FCBGA package. It is part of the Arria 10 family of 20 nm mid-range FPGAs and is designed for performance-sensitive, power-aware applications across wireless, wireline, broadcast, computing, and other markets.

This device combines high logic density, large embedded memory, and extensive I/O to support complex mid-range designs where integration, thermal range, and industrial-grade reliability are required.

Key Features

• Core Density — 900,000 logic elements to implement large logic designs and consolidate multiple functions into a single FPGA.
• On‑Chip Memory — 59,234,304 total RAM bits of embedded memory for packet buffers, lookup tables, and state storage.
• I/O Capacity — 624 user I/Os to interface with external memory, PHYs, and peripherals without extensive external multiplexing.
• Package & Mounting — 1932‑FBGA package in a 1932‑FCBGA (45×45) footprint; surface mount for high‑density board designs.
• Power Supply — Core voltage range 870 mV to 980 mV to match required FPGA core rail specifications.
• Operating Temperature — Industrial temperature grade from −40 °C to 100 °C for deployment in demanding environments.
• Family-Level Architecture — Arria 10 family features referenced in the device overview include adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock networks and PLL sources, and low‑power serial transceivers suited to applications in the family.
• Standards & Compliance — RoHS compliant.

Typical Applications

• Wireless Infrastructure — Channel and switch card implementations and mobile backhaul functions that require high logic density and flexible I/O.
• Wireline Networking — Line cards, muxponders, and transponders where embedded memory and transceiver capabilities support high‑bandwidth packet processing.
• Broadcast and Pro AV — Video and audio switching, transport, and processing systems benefitting from on‑chip memory and extensive I/O.
• Computing & Storage — Server acceleration and flash cache control leveraging large logic capacity and embedded RAM for buffering and control logic.
• Medical and Military Systems — Diagnostic imaging, radar, and guidance electronics that require industrial temperature range and high integration.

Unique Advantages

• High Logic Integration: 900,000 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board complexity and BOM count.
• Substantial On‑Chip Memory: 59,234,304 RAM bits provide large local storage for buffering and lookup tasks, minimizing external memory dependency.
• Extensive I/O Connectivity: 624 I/Os support broad peripheral and memory interfaces, simplifying routing for complex systems.
• Industrial Temperature Rating: Specified for −40 °C to 100 °C operation, suitable for deployment in harsh or temperature‑variable environments.
• Industry‑Standard Package: 1932‑FCBGA (45×45) surface‑mount package designed for dense, manufacturable PCB layouts.
• Power‑Aware Design: Core supply range of 870 mV to 980 mV aligns with Arria 10 family power architectures for efficient operation.

Why Choose 10AX090S1F45I1SG?

The 10AX090S1F45I1SG delivers a balanced combination of high logic density, large embedded RAM, and extensive I/O in an industrial‑rated Arria 10 GX package. It is positioned for engineers who need a mid‑range FPGA that supports complex logic, substantial on‑chip storage, and robust interfacing for applications across wireless, wireline, broadcast, computing, medical, and military markets.

Choosing this device provides scalability within the Arria 10 family architecture and the integration necessary to simplify system design, reduce external components, and meet demanding thermal and environmental requirements.

Request a quote or submit an inquiry for availability and pricing to begin integrating the 10AX090S1F45I1SG into your next design.