10AX090S2F45I1SG

The 10AX090S2F45I1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932‑FCBGA (45×45 mm) surface-mount package. It delivers a high logic capacity silicon solution with 900,000 logic elements and series-level capabilities for mid-range, performance-sensitive applications.

Designed for industrial-grade deployments, this device provides large embedded memory (59,234,304 total RAM bits), a broad I/O count (624 I/Os), and operating support across −40 °C to 100 °C with a core supply range of 870 mV to 980 mV. Series documentation highlights platform features such as variable‑precision DSP blocks, embedded memory blocks, transceivers, PCIe hard IP, and advanced clocking and power management.

Key Features

• High Logic Density  900,000 logic elements to implement large-scale, complex logic and custom accelerators.
• Large Embedded Memory  59,234,304 total RAM bits for on-chip data buffering, packet staging, and shared memory structures.
• Extensive I/O  624 I/O pins to support wide parallel interfaces, memory buses, and multi-protocol I/O topologies.
• Advanced FPGA Architecture (series-level)  Arria 10 series features cited in the device overview include adaptive logic modules, variable‑precision DSP blocks, and diverse embedded memory block types to support signal processing and compute tasks.
• High-Speed Serial and Protocol Support (series-level)  Series documentation references low-power serial transceivers, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and PCIe Gen1/Gen2/Gen3 hard IP for common board-level high-speed protocols.
• Clocking and Reconfiguration (series-level)  Clock networks with PLL sources, fractional synthesis, and support for dynamic and partial reconfiguration are described in the device overview to enable flexible timing architectures and runtime updates.
• Industrial Grade and Robust Supply  Specified for industrial operation from −40 °C to 100 °C with a core voltage supply range of 870 mV to 980 mV; RoHS compliant.
• Package and Mounting  1932‑FCBGA (45×45) package in a surface-mount form factor suitable for dense board layouts requiring high I/O and thermal considerations.

Typical Applications

• Wireless Infrastructure  Channel and switch cards, remote radio head processing, and mobile backhaul systems that require programmable DSP and high I/O connectivity.
• Datacenter & Server Acceleration  Flash cache, server acceleration, and cloud compute attachments where large logic capacity and on-chip memory enable custom accelerators.
• High-Speed Networking and Wireline  40G/100G muxponders, transponders, and line cards leveraging high logic density and series-level transceiver and protocol hard IP support.
• Broadcast and Professional AV  Studio switches, transport, and videoconferencing equipment requiring flexible I/O and on-chip buffering.
• Imaging and Medical Systems  Diagnostic scanners and imaging pipelines that benefit from embedded memory and DSP resources for real-time processing.

Unique Advantages

• High compute and integration in one device: 900,000 logic elements combined with substantial on-chip RAM reduces the need for external logic and memory components.
• Flexible, performance-oriented architecture: Series-level variable-precision DSP blocks and advanced clocking enable implementation of high-throughput signal processing chains.
• Broad I/O and packaging for dense systems: 624 I/Os in a 1932‑FCBGA package support multi-channel interfaces and high-pin-count peripherals while maintaining a compact footprint.
• Built for industrial environments: Rated for −40 °C to 100 °C operation and RoHS compliant for reliable deployment in industrial applications.
• Protocol-ready silicon (series-level): Series documentation highlights PCIe Gen1/Gen2/Gen3 hard IP and support for 10 Gbps Ethernet and Interlaken, reducing integration effort for common high-speed links.
• Designed for runtime flexibility: Support for dynamic and partial reconfiguration at the series level enables in-field updates and resource partitioning without full system downtime.

Why Choose 10AX090S2F45I1SG?

The 10AX090S2F45I1SG positions itself as a high-density Arria 10 GX FPGA option for designers who need a balance of large logic capacity, abundant on-chip memory, and extensive I/O in an industrial-grade package. Its specified voltage and temperature ranges and RoHS compliance make it suitable for demanding production environments.

Choose this device when your design requires significant programmable logic resources alongside series-level capabilities such as DSP blocks, embedded memory configurations, advanced clocking, and protocol hard IP to accelerate development and simplify system integration.

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