10AX090S3F45E2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 533 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090S3F45E2LG – Arria 10 GX FPGA, 900,000 logic elements, 624 I/Os
The 10AX090S3F45E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1932-FCBGA (45×45) package. It combines high logic density with abundant embedded memory and a large I/O count, suited for mid-range, performance-sensitive applications.
As part of the Arria 10 device family, this device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military applications where performance and power efficiency are important design drivers.
Key Features
- Core & logic 900,000 logic elements provide substantial programmable logic capacity for complex digital designs.
- Embedded memory 59,234,304 total RAM bits of on-chip memory to support large buffering, packet processing, and local data storage.
- I/O & package 624 user I/Os in a 1932-FCBGA (45×45) surface-mount package enabling dense external interfacing and board-level routing flexibility.
- Power Core voltage supply range of 870 mV–930 mV for low-voltage operation in tightly controlled power domains.
- Temperature & grade Extended-grade device rated for 0 °C to 100 °C operating temperature, suitable for many commercial and industrial-adjacent environments.
- Family architecture Built on the Arria 10 device architecture with features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLL clock sources, and support for dynamic and partial reconfiguration.
- High-speed interfaces & IP Supports hardened IP and protocol features referenced in the Arria 10 family—including PCIe Gen1/2/3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet—enabling integration of common high-speed interfaces.
- Reliability & configuration Includes device-level features described in the Arria 10 family such as SEU error detection and correction, enhanced configuration options, and power management capabilities.
- Compliance RoHS compliant for environmental compatibility in modern electronics manufacturing.
Typical Applications
- Wireless infrastructure Channel and switch cards for remote radio heads and mobile backhaul where high logic density and programmable DSP resources are required.
- Wireline networking 40G/100G muxponders, transponders and line cards that require large memory buffers and hardened protocol IP.
- Broadcast and media processing Studio switches, video transport and professional audio/video processing leveraging abundant logic and embedded memory.
- Computing and storage Server acceleration, flash cache and cloud compute functions that benefit from on-chip memory and high I/O bandwidth.
- Medical and defense systems Diagnostic imaging, radar and electronic warfare applications where reconfigurable logic and DSP capabilities are valuable.
Unique Advantages
- High logic capacity: 900,000 logic elements enable large-scale custom logic implementations without immediate migration to larger device families.
- Large on-chip memory: Over 59 million RAM bits reduce dependence on external memory for many buffering and data-path tasks.
- Extensive I/O in a compact package: 624 I/Os in a 1932-FCBGA (45×45) package provide broad external connectivity while minimizing PCB area.
- Low-voltage core operation: 870 mV–930 mV core supply supports efficient power-domain design and integration into modern low-voltage systems.
- Family-level IP and features: Access to Arria 10 architecture capabilities—DSP blocks, PLLs, hardened PCIe and high-speed PHY features—accelerates design implementation.
- RoHS compliant and extended grade: Environmentally compliant with a 0 °C–100 °C operating range for robust deployment in many commercial applications.
Why Choose 10AX090S3F45E2LG?
The 10AX090S3F45E2LG delivers a balance of high logic density, substantial embedded memory, and extensive I/O in a single surface-mount 1932-FCBGA package. It is positioned for mid-range applications that require programmable performance, on-chip memory bandwidth, and integration with hardened interface IP found in the Arria 10 family.
This device is appropriate for design teams building wireless infrastructure, high-speed networking, media processing, server acceleration, and advanced imaging or defense systems who need a scalable, field-programmable solution with family-level features and power-management capabilities.
Request a quote or submit a procurement inquiry for 10AX090S3F45E2LG to begin your design evaluation and sourcing process.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018