10AX090S3F45I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 59234304 900000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 244 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 339620 | Number of Logic Elements/Cells | 900000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59234304 |
Overview of 10AX090S3F45I2LG – Arria 10 GX FPGA, 900,000 logic elements
The 10AX090S3F45I2LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1932‑FCBGA (45×45) package designed for midrange, high-performance and power-sensitive applications. Built on the Arria 10 device family, this industrial‑grade FPGA combines high logic density, large embedded memory, and extensive I/O to address demanding communications, compute, and signal-processing designs.
With 900,000 logic elements, 59,234,304 bits of on-chip RAM and 624 I/O, the device targets applications that require substantial programmable logic, high channel counts, and a compact surface-mount package while operating over an extended industrial temperature range.
Key Features
- Logic Capacity 900,000 logic elements provide high-density programmable fabric for complex digital logic and state-machine implementations.
- Embedded Memory 59,234,304 total RAM bits support large on-chip buffering, lookup tables, and memory-intensive algorithms.
- I/O and Connectivity 624 I/O pins enable broad external interfacing and high channel counts for multi‑lane and multi‑interface systems.
- Transceiver and Protocol Support (Series) Arria 10 device family documentation highlights built‑in support for serial transceivers and hard IP for common interfaces such as PCIe and high‑speed Ethernet, enabling high‑bandwidth system designs.
- DSP and Logic Architecture (Series) The Arria 10 family includes adaptive logic modules and variable‑precision DSP blocks for signal processing and arithmetic-intensive tasks.
- Power and Voltage Core supply range of 870 mV to 930 mV for the device core, supporting the Arria 10 family’s power‑efficient architecture.
- Package and Mounting 1932‑FCBGA (45×45) surface-mount package provides a high‑pin‑count footprint for dense system integration.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- Compliance RoHS compliant for current environmental regulations.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment that benefit from high logic density and large on‑chip memory.
- High‑speed wireline systems Line cards, muxponders and transponders for 40G/100G applications that require significant programmable logic and multi‑lane I/O.
- Broadcast and professional AV Studio switches and video transport equipment that leverage embedded memory and DSP resources for media processing and switching.
- Compute and storage acceleration Flash cache, server acceleration, and cloud compute nodes using programmable logic for custom offload and data-path acceleration.
- Medical and industrial systems Imaging and diagnostic equipment or industrial control systems that require industrial temperature operation and high integration.
Unique Advantages
- High logic density: 900,000 logic elements allow consolidation of complex functions onto a single device, reducing board count and BOM complexity.
- Large on‑chip memory: 59,234,304 bits of RAM enable substantial buffering and algorithm acceleration without relying solely on external memory.
- Extensive I/O capacity: 624 I/Os give designers the flexibility to support multiple interfaces and lanes from one FPGA package.
- Industrial robustness: Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging environments.
- Power‑efficient core voltage: Core supply range of 870–930 mV aligns with the Arria 10 family’s focus on power efficiency for midrange FPGA applications.
- High‑pin‑count package: The 1932‑FCBGA (45×45) package enables dense routing and system integration for complex designs.
Why Choose 10AX090S3F45I2LG?
The 10AX090S3F45I2LG positions itself as a high‑capacity, industrial‑grade Arria 10 GX FPGA suited for midrange applications that demand large programmable logic resources, significant on‑chip memory, and broad I/O. Its combination of 900,000 logic elements, over 59 million bits of RAM, and 624 I/Os in a 1932‑FCBGA package makes it a practical choice for communications, compute acceleration, broadcast, and industrial systems.
Backed by the Arria 10 device family documentation and design resources, this device supports scalable designs where integration density, operational temperature range, and power efficiency are key considerations.
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