10AX090S4F45I3LG

The 10AX090S4F45I3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) device in a 1932-ball FCBGA package. It is part of the 20 nm Arria 10 family of mid-range FPGAs, designed for performance and power-sensitive midrange applications across diverse markets.

This device delivers high logic density, substantial on-chip RAM, and broad I/O capability while supporting industrial temperature operation, making it suitable for demanding embedded and communications designs.

Key Features

• Logic Capacity  900,000 logic elements, providing a high-density programmable fabric for complex logic and acceleration tasks.
• On-Chip Memory  59,234,304 total RAM bits available for buffering, frame storage, and inline processing.
• I/O  624 user I/O pins to support rich external connectivity and multiple memory or interface lanes.
• Package and Mounting  1932-ball BGA (1932-FCBGA, 45×45) package; surface mount for standard PCB assembly processes.
• Voltage Supply  Core supply range from 870 mV to 930 mV to match system power-rail designs.
• Temperature Range  Industrial operating range of −40 °C to 100 °C for robust field operation.
• Grade and Compliance  Industrial grade device; RoHS compliant.

Typical Applications

• Wireless  Baseband and front-end processing in channel and switch cards, and mobile backhaul equipment where programmable logic and on-chip memory accelerate signal paths.
• Wireline  Line cards, muxponders and transponder designs (40G/100G) that require high logic density and substantial buffering.
• Broadcast and Media  Studio switching, video routing, and professional audio/video processing that benefit from high I/O counts and embedded RAM.
• Computing and Storage  Server acceleration, flash-cache and cloud infrastructure functions leveraging programmable logic for custom processing and offload.
• Medical and Defense Systems  Diagnostic imaging, radar, and electronic warfare systems that require industrial-temperature operation and flexible hardware configurability.

Unique Advantages

• High Logic Density: 900,000 logic elements provide capacity for complex datapaths, protocol stacks, and hardware accelerators on a single device.
• Large Embedded Memory: 59.2 Mbits of on-chip RAM supports significant buffering and stateful processing without external memory for many use cases.
• Extensive I/O: 624 I/O pins enable multiple high-bandwidth interfaces and flexible system partitioning.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for deployment in harsh and controlled industrial environments.
• Compact FCBGA Package: 1932-FCBGA (45×45) package balances high pin count with a compact footprint for system integration.
• Low-Voltage Core Operation: Core supply range of 870–930 mV supports modern power-rail designs and system power optimization.

Why Choose 10AX090S4F45I3LG?

The 10AX090S4F45I3LG positions itself as a high-density, mid-range FPGA option for designers who need substantial logic, on-chip memory, and broad I/O in an industrial-temperature device. Its place in the Arria 10 family aligns it with solutions targeted at high-performance, power-sensitive applications across wireless, wireline, broadcast, computing, medical, and defense markets.

Backed by the Arria 10 device documentation and ecosystem, this device is suitable for teams seeking a scalable, programmable platform to consolidate functions, accelerate processing, and retain flexibility through field-upgradable logic.

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