10AX090S4F45E3SG

The 10AX090S4F45E3SG is an Intel Arria 10 GX field‑programmable gate array supplied in a 1932‑ball FCBGA (45×45 mm) package. Built on the Arria 10 device family architecture, it targets mid‑range applications that require a balance of high logic capacity, on‑chip memory, and IO connectivity.

With 900,000 logic elements, 59,234,304 total RAM bits and 624 I/O pins, this device is aimed at markets such as wireless, wireline, broadcast, and compute/storage where performance, power efficiency and system integration matter.

Key Features

• Logic Capacity 900,000 logic elements for complex programmable logic, control and datapath implementations.
• On‑Chip Memory 59,234,304 total RAM bits to support large buffers, packet buffering and local data storage.
• I/O Density 624 I/O pins to enable high‑density external device and memory interfacing.
• Package 1932‑BBGA / 1932‑FCBGA (45×45) surface‑mount package for high pin‑count, compact board integration.
• Power Supply Core voltage range 870 mV to 930 mV for regulated FPGA core operation.
• Operating Temperature Rated for 0 °C to 100 °C; device grade: Extended.
• Series‑Level Capabilities Arria 10 family features noted in the device overview include variable‑precision DSP blocks, embedded memory blocks, clock networks with PLL sources, and low‑power serial transceivers—enabling a range of signal processing and high‑speed I/O tasks.
• Standards and Compliance RoHS compliant for environmental compliance in manufacturing.

Typical Applications

• Wireless Infrastructure Channel processing, remote radio head components and mobile backhaul designs that require programmable logic and DSP resources.
• Wireline and Telecom Line cards, muxponders and transponders where high I/O count and on‑chip memory support packet handling and protocol bridging.
• Broadcast and Media Video switching, signal routing and real‑time media processing leveraging the device's logic and memory resources.
• Compute and Storage Acceleration Server acceleration, flash cache and cloud infrastructure offload that benefit from programmable datapath and memory capacity.

Unique Advantages

• Substantial Logic Resources: 900,000 logic elements allow large, integrated designs to be implemented in a single device, reducing BOM and board complexity.
• High Memory Capacity: 59,234,304 RAM bits enable on‑chip buffering and data staging that improve latency and throughput for packet and stream processing.
• High I/O Count: 624 I/Os provide flexibility for multi‑lane interfaces, external memory buses and mixed‑signal connectivity without extensive multiplexing.
• Compact High‑Pin Package: 1932‑ball FCBGA (45×45) supports dense routing and thermal handling for high‑performance board designs.
• Balanced Power Envelope: Specified core voltage range (870–930 mV) supports regulated power architectures common in systems targeting Arria 10 devices.
• Extended Grade Availability: Rated 0 °C to 100 °C for designs targeting commercial and extended operating environments.

Why Choose 10AX090S4F45E3SG?

The 10AX090S4F45E3SG positions Arria 10 GX capabilities—large logic array, significant on‑chip memory and abundant I/O—in a single 1932‑ball FCBGA package for systems that need integration without sacrificing capacity. It is appropriate for engineering teams building mid‑range performance systems across communications, broadcast and compute acceleration who need a combination of programmable logic, DSP and memory on a compact board footprint.

Choosing this device gives designers access to Arria 10 family architectural features documented in the device overview while providing verifiable electrical and environmental characteristics (core voltage 870–930 mV, operating range 0 °C–100 °C, RoHS compliant) for procurement and system design planning.

Request a quote or submit a procurement inquiry to receive pricing and availability for 10AX090S4F45E3SG.